Products & Technologies
Products & Services
Contact
Products & Services
Products & Technologies
Services
Resources
Contact
Media Kits
February 10, 2026 | SEMICON Korea 2026
Press Release
Applied Materials Unveils Transistor and Wiring Innovations for Faster AI Chips
Media Briefing Presentations
- Applied Producer Viva Radical Treatment
- Applied Centris Sym3 Z Magnum Etch
- Applied Centris Spectral Molybdenum ALD
Videos
Images
- Group Image
- GAA Transistor Application
- Applied Producer Viva Radical Treatment
- Applied Centris Sym3 Z Magnum Etch
- Applied Centris Spectral Molybdenum ALD
Perspectives
October 7, 2025 | SEMICON West 2025
Press Release
Applied Materials Unveils Next-Gen Chipmaking Products to Supercharge AI Performance
Media Briefing Presentation Materials
- Applied Centura Xtera Epi
- Applied Kinex Integrated Die-to-Die Wafer Hybrid Bonding System
- Applied PROVision 10 eBeam Metrology
Videos
- Applied Centura Xtera Epi
- Applied Kinex Integrated Die-to-Die Wafer Hybrid Bonding System
- SEMICON West Product Launch
Images
- Applied Centura Xtera Epi
- Applied Kinex Integrated Die-to-Die Wafer Hybrid Bonding System
- Applied PROVision 10 eBeam Metrology
Perspectives
- Why the World Needs an Integrated Chiplet-to-Wafer Hybrid Bonder
- Backside Power Demands Innovation in eBeam Metrology
- HBM Memory Demands eBeam Metrology
Technology Breakfast
August 6, 2025 | U.S. Manufacturing Announcement
February 19, 2025 | SEMVision H20 Product Launch
Press Release
Applied Materials Accelerates Chip Defect Review with Next-Gen eBeam System
System Renderings
SEMVision H20
November 21, 2024 | Applied Materials Breakthrough To Bring OLED Displays to Tablets, PCs and TVs
November 19, 2024 | Leadership Summit for Advanced Packaging
July 9, 2024 | 2024 SEMICON West Technology Breakfast
Press Release
Applied Materials Unveils Chip Wiring Innovations for More Energy-Efficient Computing
Video Animation
Endura™ Copper Barrier Seed IMS™ with Volta™ Ruthenium CVD
Blogs
- The Race for AI Leadership is Fueled by Materials Engineering
- Beyond Backside Power: Scaling Chips to 2nm and Beyond Also Requires Frontside Wiring Innovations
- Power-Hungry AI Applications Demand More Energy-Efficient Computing
Profiles
Speaker Bios
Videos
We Work Here
How Do You Make a Semiconductor Chip
Supporting Our Communities
Our Newest Platform: Vistara
Pattern-Shaping Technology: Sculpta
Engineering the Gate-All-Around Transistor
Wiring Innovation: Endura CuBS Volta Ruthenium
Hybrid Bonding: Kinex
Selective Epitaxy: Xtera
B-roll
Applied Materials Corporate Headquarters
Semiconductor R&D and Manufacturing
Display Equipment
Brand Logos
Click logo to download
Visit our YouTube Channel for More Videos
Corporate Information
Contact Media Relations
Media and analyst inquiries, including requests for images and b-roll, can be directed to Media_Relations@amat.com