Media Kits & Digital Assets

October 7-9, 2025 | SEMICON West 2025

Applied Materials showcased breakthrough materials engineering technologies at SEMICON West, driving next-generation logic, memory and advanced packaging innovations essential for AI and high-performance computing. With industry-first solutions like Kinex™ hybrid bonding, Xtera™ epitaxial deposition,  and PROVision™ eBeam metrology, Applied is accelerating chipmaker roadmaps to enable major device inflections and optimize performance, power, and cost. ​

August 6, 2025 | U.S. Manufacturing Announcement

Applied Materials, Inc. is working with Apple and Texas Instruments (TI) to bolster the semiconductor manufacturing supply chain in the United States. Applied is supporting Apple’s partnership with TI, announced today, by supplying American-made chipmaking equipment from Austin, Texas to TI’s U.S. factories. 

February 19, 2025 | SEMVision H20 Product Launch

Applied Materials, Inc. today introduced a new defect review system to help leading semiconductor manufacturers continue pushing the limits of chip scaling. The company’s SEMVision™ H20 system combines the industry’s most sensitive electron beam (eBeam) technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects in the world’s most advanced chips.

November 21, 2024 | Applied Materials Breakthrough to Bring OLED Displays to Tablets, PCs and TVs

Applied Materials, Inc. today introduced the MAX OLED™ solution, a patented OLED pixel architecture and revolutionary display manufacturing technology designed to bring the superior OLED displays found in high-end smartphones to tablets, PCs and eventually TVs.

November 19, 2024 | Leadership Summit for Advanced Packaging

Applied Materials, Inc. today announced plans to expand its global EPIC* innovation platform with a new collaboration model specifically designed to accelerate commercialization of advanced chip packaging technologies.

July 9, 2024 | 2024 SEMICON West Technology Breakfast

Applied Materials, Inc. today introduced materials engineering innovations designed to increase the performance-per-watt of computer systems by enabling copper wiring to scale to the 2nm logic node and beyond. “The AI era needs more energy-efficient computing, and chip wiring and stacking are critical to performance and power consumption,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials.