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October 7, 2025 | SEMICON West 2025
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August 6, 2025 | U.S. Manufacturing Announcement
February 19, 2025 | SEMVision H20 Product Launch
Press Release
Applied Materials Accelerates Chip Defect Review with Next-Gen eBeam System
System Renderings
SEMVision H20
November 21, 2024 | Applied Materials Breakthrough To Bring OLED Displays to Tablets, PCs and TVs
November 19, 2024 | Leadership Summit for Advanced Packaging
July 9, 2024 | 2024 SEMICON West Technology Breakfast
Press Release
Applied Materials Unveils Chip Wiring Innovations for More Energy-Efficient Computing
Video Animation
Endura™ Copper Barrier Seed IMS™ with Volta™ Ruthenium CVD
Blogs
- The Race for AI Leadership is Fueled by Materials Engineering
- Beyond Backside Power: Scaling Chips to 2nm and Beyond Also Requires Frontside Wiring Innovations
- Power-Hungry AI Applications Demand More Energy-Efficient Computing
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How Do You Make a Semiconductor Chip
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Our Newest Platform: Vistara
Pattern-Shaping Technology: Sculpta
Engineering the Gate-All-Around Transistor
Wiring Innovation: Endura CuBS Volta Ruthenium
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Applied Materials Corporate Headquarters
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Media and analyst inquiries, including requests for images and b-roll, can be directed to Media_Relations@amat.com