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Past Events

VLSI Symposium on Technology and Circuits
Kyoto, Japan
Date Presentation Presenter
June 10, 2025 Panel Discussion: What can semiconductor industry do for greener society? Bala Haran, Panel Moderator
June 12, 2025 Compressive Diffusion Break Stressor for Gate-All-Around Nanosheet pFET Transistor Performance Improvement S. Hung, A. Pal, C. Zhao, E. Bazizi, V. Chen, H. Chen, A. Londono Calderon, P. Anekal
June 12, 2025 BEOL Interconnects for 2nm Technology Node and Beyond Thareja, G. Qu, N. Giulani, D. Cornigli, E. Piccinini, X. Wang, A. Palmieri, S. Barkam, M. Jamieson, B. Xie, S. You, S. Sharma, and Y. Wu
June 12, 2025 Investigation of Post-Bonding Die Stretching in Die-to-Wafer Hybrid Bonding Y. Lu, K. Zheng, L. Jiang, Y. Wang, R. Hung, and E. Bazizi

IEEE International Interconnect Technology Conference
Busan, South Korea
Date Presentation Presenter
June 5, 2025 Hybrid bonding: die to wafer dynamic process investigation through advanced 3D modeling Yinan Lu

Electronic Components and Technology Conference (ECTC)
Dallas, Texas
Date Presentation Presenter
May 27, 2025 Panel Discussion: Ultra High Density Interconnect Technologies and Supply Chain Readiness for AI & HPC Niranjan Khasgiwale
May 27, 2025 Panel Discussion: Hybrid Bonding (HB): to B, or not to B? Needs and challenges for the Next Decade Mascha Gorchichko (Chair)
May 28, 2025 Integration Solution for Thin D2W Hybrid Bonding for Yield and Reliability Xiaodong Chen, Guan Huei See, Patrick Lim, Prayudi Lianto, Peng Suo, Andy Yong, Santosh Kumar Rath, Xing Zhao
May 28, 2025 SiCN CMP Integration for Hybrid Bonding Applications Prayudi Lianto, Rachel Emmanuelle Raphael, Avery Tan, Ching Keat Chia, Xiaobo Li, Hui Min Lee, Xiaodong Chen
May 28, 2025 Scalable Chip-to-Wafer Hybrid Bonding Processes for Fine-pitch (3 µm and 6 µm) Interconnections Chandra Rao B. S. S., Arvind Sundaram, Mishra Dileep, Yong Liang Ye, Ratan Bhimrao Umralkar, Vasarla Nagendra Sekhar, Patrick Lim, Santosh Kumar Rath
May 29, 2025 Integration, Materials and Equipment Innovations to Enable 100 nm Pitch W2W Bonding for Memory-to-Logic and Logic-to-Logic 3D Stacking Raghav Sreenivasan, Kevin Ryan, Jeremiah Hebding, Tyler Sherwood, Siddarth Krishnan, Ying Trickett, Michael Chudzik
May 29, 2025 Panel Level Interposer by Using Glass Carrier for 2.5D Advance IC Package Application Hungyu Wu
May 29, 2025 Reliability Assessment of a Hybrid Wiring Layer Assembly for Low-Cost Sub 10 µm Pitch Integration Kai Zheng, Gilbert Park, Han-Wen Chen, Steven Verhaverbeke
May 29, 2025 Physics-Based Modeling With Nanoindentation on the Mechanical Reliability of TGV Substrates Under Annealing Effects Shih-Hsien Lee, Shih-Hao Kuo
May 29, 2025 Electrical Performance of 2-Platen CMP Process for Hybrid Bonding Application With Conventional / nt-Cu and Low Temperature of SixNy / SixOy Dielectrics Prayudi Lianto, Avery Tan, Joselyn Lie, Patrick Lim, Guan Huei See
May 29, 2025 Process Approaches to Enable 200 °C Hybrid Bonding With SiCN Bond Layer and 0.5 µm Pitch Kai Ma, Nikolaos Bekiaris, Eric J Bergman, Santosh Kumar Rath, Lei Xue
May 29, 2025 Aluminum Nitride With Thermal Conductivity > 100W/mK as a Fusion Bonding Film for Backside Power Delivery Michel Khoury, Liang Song, Chris Lee, Chengyu Liu, Maria Gorchichko, Kun Li, Tom Osterheld, Meng Zhu
May 30, 2025 Fabrication Optimization and Reliability Study of Hyper RDL (HRDL) Interposer for Advanced Packaging and Heterogeneous Integration Chien-Kang Hsiung
May 30, 2025 X64 UCIe Chiplet Interconnection at 32 GT/s on a Silicon Core Substrate Steven Verhaverbeke, Seann Ayers, Shivkumar Chiruvolu, Han-Wen Chen

SEMICON SEA
Singapore
Date Presentation Presenter
May 20, 2025 CEO Summit Prabu Raja
May 20, 2025 Session Chair: Remarks by Session Chair (Semiconductor Regional HR Forum) Jenny Chan
May 21, 2025 Advanced Packaging & Heterogeneous Integration Summit Terry Lee

CS MANTECH
New Orleans, LA
Date Presentation Presenter
May 20, 2025 Session Chair: Power Devices II Shiva Rai
May 20, 2025 Session Chair: Advanced Packaging & Integration Shiva Rai
May 22, 2025 Poster Session: Off-Axis Sputtering Fabrication of ITO Contact Layers for pGaN Lavinia Nistor, Houssem Boukhalfa, Jerome Machillot

International Memory Workshop & Leti Workshop
Monterey, California
Date Presentation Presenter
May 18, 2025 Tutorial: Materials, Processes and Systems Co-optimization for advanced HBMs Gaurav Thareja
May 18, 2025 Simulation-driven material engineering for memory devices Enrico Piccinini
May 19, 2025 Poster Session: Simulation of Ge-rich PCM Device Material Evolution from Post-Deposition Anneal to Programming Operations Enrico Piccinini
May 19, 2025 Poster Session Chair Arun Karamcheti
May 21, 2025 Demonstration of Conformal MoS2 on High-Aspect-Ratio Structures up to 40:1 and Exploration of Manufacturability in a 300mm Fab for 3D NAND applications Hao-Ling Tang

Strategic Materials Conference Korea
South Korea
Date Presentation Presenter
May 14, 2025 Materials Engineering Innovations to Address HBM Challenges for AI Applications Prayudi Lianto

Display Week 2025
San Jose, California
Date Presentation Presenter
May 13, 2025 Business Conference Keynote Session Indrajit Lahiri
May 13, 2025 Symposium, Session 11 Revolutionary MAX OLED Solution for Next-Generation OLED Displays Yusin Lin

In the Community

Upcoming Events

Applied Materials to Build Reading Kits with Cultivating Literacy

Cultivating Literacy is a family literacy nonprofit serving families in San Jose by providing dual-language and play-based programming to develop a child's love for reading. Believe it or not, they are preparing for back-to-school season already! Applied Materials aims to provide 150 San Jose families with reading kits to support their TK-3rd graders.

Past Events

Applied Materials EarthWorks Employee Environmental Campaign

From April through June, employees from Applied sites all over the world will come together to learn about and take action for environmental sustainability.

Learn More

YWCA Tribute to Women Awards

For more than four decades, the Golden Gate Silicon Valley YWCA’s Tribute to Women Awards has recognized the remarkable contributions of women in the workplace. These awards spotlight women in executive positions, emerging leaders, and nonprofit innovators, directly supporting YWCA’s mission to empower women.

We are pleased to announce the Applied Materials 2025 Tribute to Women Award Honorees:
· Hali Forstner
· Weiti Li
· Teri Nissen

Additionally, the 2025 Tribute to Women Award Emerging Leader Honorees are:
· Stephanie Tchikovani
· Allison Yau

Congratulations to this distinguished group of awardees and valued members of the Applied Materials team!

Learn More About the Awards Dinner Event

Halo Engage for Good Awards

The Applied Materials Momentum Fund is a finalist in the Best Education Initiative category for the 2025 Halo awards presented by Engage for Good. This collaborative effort between Applied Materials and Last Mile Education Fund is working to remove financial barriers for women nearing completion of their engineering degrees.

Learn More about the 2025 Halo Awards

Applied Materials Takeover of Reinvented Magazine Focuses on Semiconductors

Reinvented Magazine is aiming to reimagine how youth perceive the STEM fields by providing engaging, relatable, and informative magazine issues on STEM topics. Applied Materials collaborated with Reinvented on their upcoming semiconductor issue!

We are excited to spotlight 5 incredible employees that shared their own experiences! Check out their stories below.

The virtual semiconductor magazine issue is LIVE now.

Read it today!