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Upcoming Events

Strategic Materials Conference Korea
South Korea
Date Presentation Presenter
May 14, 2025 Materials Engineering Innovations to Address HBM Challenges for AI Applications Prayudi Lianto

International Memory Workshop & Leti Workshop
Monterey, California
Date Presentation Presenter
May 18, 2025 Tutorial: Materials, Processes and Systems Co-optimization for advanced HBMs Gaurav Thareja
May 18, 2025 Simulation-driven material engineering for memory devices Enrico Piccinini
May 19, 2025 Poster Session: Simulation of Ge-rich PCM Device Material Evolution from Post-Deposition Anneal to Programming Operations Enrico Piccinini
May 19, 2025 Poster Session Chair Arun Karamcheti
May 21, 2025 Demonstration of Conformal MoS2 on High-Aspect-Ratio Structures up to 40:1 and Exploration of Manufacturability in a 300mm Fab for 3D NAND applications Hao-Ling Tang

CS MANTECH
New Orleans, LA
Date Presentation Presenter
May 20, 2025 Session Chair: Power Devices II Shiva Rai
May 20, 2025 Session Chair: Advanced Packaging & Integration Shiva Rai
May 22, 2025 Poster Session: Off-Axis Sputtering Fabrication of ITO Contact Layers for pGaN Lavinia Nistor, Houssem Boukhalfa, Jerome Machillot

SEMICON SEA
Singapore
Date Presentation Presenter
May 20, 2025 CEO Summit Prabu Raja
May 20, 2025 Session Chair: Remarks by Session Chair (Semiconductor Regional HR Forum) Jenny Chan
May 21, 2025 Advanced Packaging & Heterogeneous Integration Summit Terry Lee

Electronic Components and Technology Conference (ECTC)
Dallas, Texas
Date Presentation Presenter
May 27, 2025 Panel Discussion: Ultra High Density Interconnect Technologies and Supply Chain Readiness for AI & HPC Niranjan Khasgiwale
May 27, 2025 Panel Discussion: Hybrid Bonding (HB): to B, or not to B? Needs and challenges for the Next Decade Mascha Gorchichko (Chair)
May 28, 2025 Integration Solution for Thin D2W Hybrid Bonding for Yield and Reliability Xiaodong Chen, Guan Huei See, Patrick Lim, Prayudi Lianto, Peng Suo, Andy Yong, Santosh Kumar Rath, Xing Zhao
May 28, 2025 SiCN CMP Integration for Hybrid Bonding Applications Prayudi Lianto, Rachel Emmanuelle Raphael, Avery Tan, Ching Keat Chia, Xiaobo Li, Hui Min Lee, Xiaodong Chen
May 28, 2025 Scalable Chip-to-Wafer Hybrid Bonding Processes for Fine-pitch (3 µm and 6 µm) Interconnections Chandra Rao B. S. S., Arvind Sundaram, Mishra Dileep, Yong Liang Ye, Ratan Bhimrao Umralkar, Vasarla Nagendra Sekhar, Patrick Lim, Santosh Kumar Rath
May 29, 2025 Integration, Materials and Equipment Innovations to Enable 100 nm Pitch W2W Bonding for Memory-to-Logic and Logic-to-Logic 3D Stacking Raghav Sreenivasan, Kevin Ryan, Jeremiah Hebding, Tyler Sherwood, Siddarth Krishnan, Ying Trickett, Michael Chudzik
May 29, 2025 Panel Level Interposer by Using Glass Carrier for 2.5D Advance IC Package Application Hungyu Wu
May 29, 2025 Reliability Assessment of a Hybrid Wiring Layer Assembly for Low-Cost Sub 10 µm Pitch Integration Kai Zheng, Gilbert Park, Han-Wen Chen, Steven Verhaverbeke
May 29, 2025 Physics-Based Modeling With Nanoindentation on the Mechanical Reliability of TGV Substrates Under Annealing Effects Shih-Hsien Lee, Shih-Hao Kuo
May 29, 2025 Electrical Performance of 2-Platen CMP Process for Hybrid Bonding Application With Conventional / nt-Cu and Low Temperature of SixNy / SixOy Dielectrics Prayudi Lianto, Avery Tan, Joselyn Lie, Patrick Lim, Guan Huei See
May 29, 2025 Process Approaches to Enable 200 °C Hybrid Bonding With SiCN Bond Layer and 0.5 µm Pitch Kai Ma, Nikolaos Bekiaris, Eric J Bergman, Santosh Kumar Rath, Lei Xue
May 29, 2025 Aluminum Nitride With Thermal Conductivity > 100W/mK as a Fusion Bonding Film for Backside Power Delivery Michel Khoury, Liang Song, Chris Lee, Chengyu Liu, Maria Gorchichko, Kun Li, Tom Osterheld, Meng Zhu
May 30, 2025 Fabrication Optimization and Reliability Study of Hyper RDL (HRDL) Interposer for Advanced Packaging and Heterogeneous Integration Chien-Kang Hsiung
May 30, 2025 X64 UCIe Chiplet Interconnection at 32 GT/s on a Silicon Core Substrate Steven Verhaverbeke, Seann Ayers, Shivkumar Chiruvolu, Han-Wen Chen

IEEE International Interconnect Technology Conference
Busan, South Korea
Date Presentation Presenter
June 5, 2025 Hybrid bonding: die to wafer dynamic process investigation through advanced 3D modeling Yinan Lu

VLSI Symposium on Technology and Circuits
Kyoto, Japan
Date Presentation Presenter
June 10, 2025 Panel Discussion: What can semiconductor industry do for greener society? Bala Haran, Panel Moderator
June 12, 2025 Compressive Diffusion Break Stressor for Gate-All-Around Nanosheet pFET Transistor Performance Improvement S. Hung, A. Pal, C. Zhao, E. Bazizi, V. Chen, H. Chen, A. Londono Calderon, P. Anekal
June 12, 2025 BEOL Interconnects for 2nm Technology Node and Beyond Thareja, G. Qu, N. Giulani, D. Cornigli, E. Piccinini, X. Wang, A. Palmieri, S. Barkam, M. Jamieson, B. Xie, S. You, S. Sharma, and Y. Wu
June 12, 2025 Investigation of Post-Bonding Die Stretching in Die-to-Wafer Hybrid Bonding Y. Lu, K. Zheng, L. Jiang, Y. Wang, R. Hung, and E. Bazizi
Past Events

CS International Conference
Brussels, Belgium
Date Presentation Presenter
April 9, 2025 Solving Challenges in Compound Semiconductors: An Equipment Supplier’s Perspective David Britz

IEEE International Reliability Physics Symposium
Monterey, California
Date Presentation Presenter
March 30, 2025 CMOS Device Reliability: Challenges and Physics Fundamentals Luca Larcher and Gaurav Thareja
April 3, 2025 Novel Manufacturing Technologies to enable Advanced 3D Architectures Shankar Venkataraman
April 3, 2025 3D NAND Flash Device-level reliability Milan Pesic

China Semiconductor Technology International Conference
Shanghai, China
Date Presentation Presenter
March 24, 2025 Materials Engineering Innovations to Address Next-Gen Electronics Packaging Challenges Terrance Lee
March 25, 2025 Digital lithography David Zou
March 25, 2025 Reduction of Wafer Backside Aluminum Contamination for HARP STI Process Zhuo Xiong
March 25, 2025 RTPC X Pre-Thickness Control Function on Metal CMP Layer Mingtao Luo
March 25, 2025 FullVision Endpoint System Application on Thick Dielectric Film CMP Uniformity Control, Weihan Zhu
March 24, 2025 Trends and Inflections in wafer metrology and inspection Siqun Xiao
March 24, 2025 In-Device SEM based Overlay Metrology on VIA Layer of Logic Process Chao Zhou
March 25, 2025 APF as a capping layer in post-implantation high temperature anneal process for SiC MOSFET Zhuo Xiong

In the Community

Upcoming Events

Applied Materials EarthWorks Employee Environmental Campaign

From April through June, employees from Applied sites all over the world will come together to learn about and take action for environmental sustainability.

Learn More

Halo Engage for Good Awards

The Applied Materials Momentum Fund is a finalist in the Best Education Initiative category for the 2025 Halo awards presented by Engage for Good. This collaborative effort between Applied Materials and Last Mile Education Fund is working to remove financial barriers for women nearing completion of their engineering degrees.

Learn More about the 2025 Halo Awards

YWCA Tribute to Women Awards

For more than four decades, the Golden Gate Silicon Valley YWCA’s Tribute to Women Awards has recognized the remarkable contributions of women in the workplace. These awards spotlight women in executive positions, emerging leaders, and nonprofit innovators, directly supporting YWCA’s mission to empower women.

We are pleased to announce the Applied Materials 2025 Tribute to Women Award Honorees:
· Hali Forstner
· Weiti Li
· Teri Nissen

Additionally, the 2025 Tribute to Women Award Emerging Leader Honorees are:
· Stephanie Tchikovani
· Allison Yau

Congratulations to this distinguished group of awardees and valued members of the Applied Materials team!

Learn More About the Awards Dinner Event
Past Events

Community Affairs Team to Speak at YourCause by Blackbaud Social Impact Summit

Members of the Applied Materials Global Community Affairs team will share industry insights about employee engagement with a community of corporate social responsibility professionals. 

Register for the Corporate Social Impact Summit

FIRST In Texas Comes to Applied Materials Austin | March 28th, 2025

In March, Applied Materials employees will welcome a group of students from FIRST Robotics in Austin, Texas for a day filled with learning! The girls will learn more about the exciting world of semiconductor manufacturing from experts at Applied Materials. After an insightful panel session highlighting members of employee resource groups, the group of FIRST students will participate in an exciting robot building activity!

Learn More about FIRST in Texas

Michele, an Applied Materials employee of nearly 30 years(!), will be recognized for her work in the community by National Alliance for Partnerships in Equity Leadership at the National Summit for Educational Equity in Washington, DC. 

Employees from across Applied sites both virtually and in person gathered to learn from the Women’s Fund of Rhode Island to understand the global gender gaps and discover strategies to support women and girls locally.