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Applied Materials and TSMC Partner at the EPIC Center to Accelerate AI Scaling
Press Release • May 11, 2026
Applied Materials Announces ASU, RPI and Stanford to Join EPIC Center
Press Release • May 11, 2026
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
Press Release • May 3, 2026
Driving Transistor Customization for the AI Era with Trillium™ ALD
Unlocking Next-Gen AI Chips Through Advanced Materials Modification
The Angstrom Era Explained: New Master Class Series Kicks Off April 8
Applied Materials Announces Advantest as Innovation Partner for EPIC Platform in Silicon Valley
Applied Materials to Participate in Upcoming Investor Conferences
Applied Materials Introduces Deposition Systems for Angstrom-Era Logic Chips
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