GOALS AND PROGRESS
3x30
GOALS
- Reduce equivalent energy consumption for semiconductor products by 30% by 2030 from 2019 baseline
- Reduce the impact from chemical consumption for semiconductor products by 30% by 2030 from 2019 baseline
- Reduce tool footprint per production unit ratio (sqm/wph) for semiconductor products by 30% by 2030 from 2019 baseline
PROGRESS
- Average per-wafer energy use decreased ahead of schedule, in part due to changes in the mix of products sold. While we expect the reduction rate to slow, we are on track to meet or exceed our 3x30 target.
- The Design for Sustainability (DfSu) team and its engineering partners are pursuing multiple development projects that will significantly reduce chemical impact. Some of these initiatives are expected to be multi-year efforts, but we are on track to meet or exceed the 3x30 target.
- Footprint reduction to date is largely the result of productivity improvements in existing tool architectures. As new product architectures begin volume shipments to customers, the footprints will be further reduced and are expected to meet or exceed the 3x30 target.
SuCCESS2030
GOALS
- New Goal: Collect GHG data from top suppliers, and partner on reduction targets
- Drive compliance with RBA Code of Conduct and Applied Materials Standards of Business Conduct
- Increase the percentage of spend with, and representation of, women- and minority-owned businesses by 2024, aiming to reach $1 billion in diverse spend by 2027
- Transition the supply chain to recyclable content packaging, with a target of 80% by year-end 2023
PROGRESS
- Conducted GHG surveys with over 100 top suppliers in FY22
- Conducted audits with over 65 top-tier suppliers in FY22
- Met our interim goal of increasing diverse spend to 2.5% of total global supplier spend, spending $462 million with certified diverse suppliers in 2022
- As of 2022, we reached 70% and on track to meet our 2023 goal
GOALS AND PROGRESS
- 3x30
- SuCCESS2030
GOALS
- Reduce equivalent energy consumption for semiconductor products by 30% by 2030 from 2019 baseline
- Reduce the impact from chemical consumption for semiconductor products by 30% by 2030 from 2019 baseline
- Reduce tool footprint per production unit ratio (sqm/wph) for semiconductor products by 30% by 2030 from 2019 baseline
PROGRESS
- Average per-wafer energy use decreased ahead of schedule, in part due to changes in the mix of products sold. While we expect the reduction rate to slow, we are on track to meet or exceed our 3x30 target.
- The Design for Sustainability (DfSu) team and its engineering partners are pursuing multiple development projects that will significantly reduce chemical impact. Some of these initiatives are expected to be multi-year efforts, but we are on track to meet or exceed the 3x30 target.
- Footprint reduction to date is largely the result of productivity improvements in existing tool architectures. As new product architectures begin volume shipments to customers, the footprints will be further reduced and are expected to meet or exceed the 3x30 target.
GOALS
- New Goal: Collect GHG data from top suppliers, and partner on reduction targets
- Drive compliance with RBA Code of Conduct and Applied Materials Standards of Business Conduct
- Increase the percentage of spend with, and representation of, women- and minority-owned businesses by 2024, aiming to reach $1 billion in diverse spend by 2027
- Transition the supply chain to recyclable content packaging, with a target of 80% by year-end 2023
PROGRESS
- Conducted GHG surveys with over 100 top suppliers in FY22
- Conducted audits with over 65 top-tier suppliers in FY22
- Met our interim goal of increasing diverse spend to 2.5% of total global supplier spend, spending $462 million with certified diverse suppliers in 2022
- As of 2022, we reached 70% and on track to meet our 2023 goal
Design for Sustainability (3x30)
From the earliest stages of design we employ Design for Sustainability (DfSu) methods and principles—innovating systems that consume fewer resources, last longer, and support circularity. We also work to continuously improve our existing products’ sustainability performance. Our 3x30 goals guide our focus to reduce our semiconductor products’ energy consumption, impact from chemical consumption, and footprint intensity.
Innovation Spotlights
Exponential growth in data generation is driving the need for dramatic improvements in the power, performance, area, cost and time to market (PPACt) of next-generation semiconductor devices. Applied is the PPACt Enablement Company™, collaborating broadly to accelerate our customers’ technology roadmaps and encourage a more sustainable innovation model throughout our industry .
Centura® Sculpta® Pattern-Shaping Tool
The Centura Sculpta pattern-shaping system is a transformative innovation developed in collaboration with leading customers to help them reduce the number of processing steps needed in advance-node chipmaking, resulting in reduced GHG emissions and water use.
iSystem® Controller
Developed in collaboration with our customer TSMC, the iSystem Controller automates measurement of power usage from the operation of semiconductor fabrication tools, gauging actual energy use against a baseline. The iSystem controller can help customers reduce energy-related costs by about 20%.
200mm CMP System
Explosive demand for electric vehicles is moving silicon carbide chips to 200mm wafers to boost output. Applied’s 200mm CMP system precisely removes silicon carbide material from wafers to help maximize chip performance, reliability and yield.
EcoTwin™
EcoTwin is an integrated sustainability software platform designed specifically to reduce the environmental impact of wafer manufacturing tools and related subfab support equipment.
EcoTwin is currently deployed and being evaluated in etch tools at Applied labs and a customer site.
SuCCESS2030
Supply Chain Certification for Environmental and Social Sustainability (SuCCESS2030) is Applied’s 10-year roadmap for strengthening our ESG supply chain strategy for Applied’s semiconductor and display businesses. This effort builds on our foundation of supporting ethical labor practices, environmentally responsible operations, responsible minerals sourcing, international human rights standards, and diverse suppliers, including women-, minority- and LGBTQ+-owned businesses. We require our vendors and suppliers to comply with both our own Standards and the Responsible Business Alliance (RBA) Code of Conduct.
CA Transparency in Supply Chains Act >
Responsible Minerals Sourcing
Our Responsible Minerals Sourcing Policy guides our direct suppliers' sourcing of tin, tantalum, tungsten or gold (3TG) minerals. To ensure the efficacy of our policy, we use the Responsible Minerals Initiative (RMI) Responsible Minerals Assurance Process as well as independent third-party audits.
Customer and Supplier Partnerships
TSMC
With a focus on developing industry-leading and world-class semiconductor green tools, Taiwan-based TSMC teamed up with Applied Materials and other sub-fab equity suppliers to develop the iSystem™ to drive increased energy efficiency for sub-fab components with no compromise to production efficiency. iSystem helps save millions of kilowatt hours of electricity annually, thousands of tons of carbon emissions and millions in cost savings.
Infineon Technologies
Germany-based semiconductor leader in power systems and IoT, Infineon Technologies, uses the Applied Materials Advanced Productivity Family (APF) to integrate multiple manual and automated data sources across various locations to drive better data validation, consistency, and sanity checks. The result is a significant increase in project speed, as well as capacity improvements.
TransPak
For 45 years TransPak has supplied Applied Materials with crating, packaging, logistics and design solutions. It’s a partnership rooted in shared values and a common commitment to advancing ESG, and one that has enabled both companies to serve the ever-evolving needs of the world’s top tech brands.