VeritySEM AP Critical Dimension (CD) Metrology 

Advanced packaging is becoming a critical enabler of AI and high-performance computing, but it also introduces a new class of process control challenges. As chipmakers move to larger, more complex 2.5D and 3D architectures, they must manage shrinking interconnect dimensions, demanding structures such as through-silicon vias (TSVs)  and hybrid bonding interfaces, and thicker, multi-material wafers or substrates that can exhibit significant warpage. These conditions make it harder for conventional metrology approaches to deliver the precision, structural visibility and consistency needed for yield and performance control.

The VeritySEM^™ Advanced Packaging (AP) portfolio is designed to help customers address these challenges with precision eBeam metrology tailored for complex packaging environments. By combining nanometer-scale measurement sensitivity, true 3D structural insight and robust handling across warped, thick and diverse substrate types, VeritySEM systems help extend process control across critical applications such as hybrid bonding, bumps, RDL and TSV. The result is more actionable metrology for development and production teams working to improve process windows, protect yield and accelerate learning cycles.

Within the VeritySEM family, VeritySEM 7AP is optimized for high-throughput production on warped silicon substrates, while VeritySEM^® 6DAP is designed for maximum flexibility across glass and silicon substrates, a wide range of wafer thicknesses and challenging development environments. Together with the broader VeritySEM portfolio, these systems give customers a scalable path to match metrology capability with application needs today while supporting the industry’s continued evolution toward more advanced heterogeneous integration schemes, larger substrates and increasingly demanding 3D packaging flows.