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UC Berkeley to Join Applied Materials’ EPIC Center to Speed Chip Innovation
Applied Materials to Report Fiscal Third Quarter 2026 Results on Aug. 13, 2026
Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Advancing DRAM Performance With Logic-Class Technologies
How Applied Materials is Advancing Sustainability
Semiconductor Innovation is Key to Energy-Efficient AI
2026 DRAM and Advanced Packaging Master Class
Q2 2026 Applied Materials Earnings Conference Call
2026 Logic Master Class
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