Semiconductor
Wafer Fab Equipment

Applied Materials has the broadest portfolio of capabilities and technologies

Applied has the industry’s broadest suite of interconnected semiconductor manufacturing products that focus on solving our customers’ most valuable challenges and moving the industry forward. Our equipment can deposit layers of material on a wafer’s surface to change the properties of the material, shape and remove materials with atomic precision, and analyze materials and integrate devices to accelerate power, performance, area, cost and time to market.

How to make a Chip
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