Products & Technologies
Cleaning methods for photomasks used in 193i and EUV lithography are driven by sensitive mask materials and the environments in which the masks are used. Mask cleaning processes have evolved from aggressive chemical treatments to milder formulations combined with high frequency megasonics for removing smaller particles and achieving more pristine mask surfaces.
Sigmameltec’s MRC system provides mask makers with a toolset that can be adapted to their requirements, including a plasma chamber that gently yet effectively strips resist and removes residual organics. Two cleaning chambers served by a wet process robot provide segregation between chemical cleaning and the critical final cleaning steps. Available chemicals include ozonated water, CO2 water, hydrolyzed water combined with TMAH, sulfuric-peroxide mixture and SC-1.