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Applied Materials Introduces Deposition Systems for Angstrom-Era Logic Chips
Press Release • April 8, 2026
Unlocking Next-Gen AI Chips Through Advanced Materials Modification
Andy Lo • April 2, 2026
The Angstrom Era Explained: New Master Class Series Kicks Off April 8
Newsroom Staff • March 30, 2026
Applied Materials Convenes Industry Leaders on Advanced Patterning for the AI Era
Applied Materials Receives Intel EPIC Supplier Award
Applied Materials Accelerates Materials Simulation for the AI Era in Collaboration with NVIDIA
Precision from the Bottom Up: Enabling Angstrom-Era AI with Sym3™ Z Magnum™
Powering the Next Era of Contact Scaling with ALD Molybdenum
Future of Advanced Packaging: Industry Insights on Co-Innovation and Talent Development
Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley
Applied Materials and Micron Partner To Advance U.S. Innovation in Next-Generation AI Memory Solutions
Applied Materials Raises Quarterly Cash Dividend by 15 Percent
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