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Bringing Next-Generation eBeam Technology Out of the Lab and into the Fab

by Ziv Parizat | December 14, 2022

 

Detecting and characterizing tiny, buried defects in advanced logic and memory chips is challenging the resolution and speed limits of conventional eBeam technology. Applied Materials today introduced a breakthrough in eBeam imaging that gives chipmakers the ability to discover defects they’ve never been able to see before, up to 10 times faster, thereby accelerating the development and production of today’s most advanced chips.

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