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advanced imaging, SEMVision, chip defect review, AI

Advanced Patterning in the Angstrom Era: Challenges and Opportunities

by Regina Freed | February 21, 2024

As leading chipmakers begin ramping process technologies at two nanometers and below, the industry is entering a new era where chip features will be described by a different unit of measurement – the angstrom, or one-tenth of a nanometer.

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