類比和混合訊號等積體電路的成長是受到無線技術激增的推動。較高的頻率和輸出功率是這種類元件的技術要求。
The ongoing development and evolution of 200mm production technologies deliver device and yield improvements and overall fab productivity gains - all of which translate to sustained ROI for semiconductor manufacturers.
To address these requirements device manufactures are continuing to reduce their technology node at 200mm, moving to ≤0.13µm devices. Applied Materials offers chamber and system upgrades that enable installed base tools to meet these tighter performance requirements as well as provide higher throughput for increased fab productivity. These upgrades include remote clean for CVD chambers and pumping improvements for metal etch to improve particle performance as well as local center finding capability to improved wafer placement for PVD applications.
