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Olympia™

Continued process scaling is driving new levels of device performance. ALD technology is essential for a growing number of steps in DRAM, 3D NAND and logic FinFET fabrication. However, while the conformality and uniform film thickness achieved with ALD is vital for CD control, additional demands are being made on ALD to deliver a growing range of high-quality, robust films within restrictive thermal budgets of next-generation nodes.