Nokota Vmax 2 ECD

Advanced packaging manufacturers are under increasing pressure to scale performance and output for applications such as high-bandwidth (HBM), bump, RDL, mega-pillar and through-silicon via (TSV) while controlling yield risk, uptime and cost. As device architectures become more complex and wafers thinner, plating operations must manage tighter coplanarity targets, higher throughput demands, multi-metal integration, defectivity control and fab space constraints without sacrificing flexibility for changing product mixes.

Nokota Vmax^™ 2 extends Applied Materials electrochemical deposition leadership with a high-productivity advanced packaging plating system engineered to address these challenges directly. Its 20-chamber architecture, SafeSeal^™ single-touch wafer handling and VMax chamber technology help customers improve yield on sensitive wafers, increase uptime, and raise output for demanding multi-metal and high-volume applications. With demonstrated advantages in throughput, availability and cost of ownership, Nokota Vmax 2 is designed to help manufacturers produce advanced packaging structures more efficiently at scale.

Within the Applied Materials portfolio, Nokota Vmax 2 builds on the proven Nokota platform with enhancements for greater productivity, serviceability and application extendibility across advanced packaging flows. It complements broader electrochemical deposition offerings for bump, fan-out, TSV and emerging heterogeneous integration requirements, while providing a flexible path for customers who need to adapt configurations as packaging roadmaps evolve. As next-generation packaging schemes continue to advance, Nokota Vmax 2 is positioned to support future inflections with expanded capability and a scalable platform foundation.