Applied^™ Picosun^™ Sprinter^™

Applied^™ Picosun^™ Sprinter^™

The Applied^™ Picosun^™ Sprinter^™ system is designed to disrupt batch ALD production in 300 mm manufacturing lines in the semiconductor (e.g. emerging memory, transistor, capacitor), display, and IoT component industries. In Sprinter, barrier, high-k oxide, and other films are deposited with perfect ALD in mass production volumes.

Fully automated, SEMI S2/S8-certified Applied^™ Picosun^™ Sprinter^™ combines the leading single wafer film quality and uniformity with fast processing, high throughput, and uncompromising reliability.

The core of the Applied^™ Picosun^™ Sprinter^™ is its disruptively designed reaction chamber, where fully laminar precursor flows ensure perfect ALD deposition with no parasitic CVD growth. This minimizes the need for system maintenance.

Compared to vertical furnace reactors typically used for batch ALD processing, Sprinter provides higher film quality with lower thermal budget, so it is suitable also for temperature-sensitive devices.

Sprinter combines very fast process times with smaller batch sizes than in vertical furnaces, which allows greater production flexibility and minimized risk without sacrificing throughput.

The tool has also demonstrated record-breaking batch film quality.

The standard Sprinter cluster configuration consists of two ALD modules, a central wafer-handling robot with pre-heating and cooling chambers, and an EFEM station to load/unload wafers from/to the FOUPs. Sprinter can also be purchased as a standalone module ready to be integrated into an existing manufacturing line or cluster.

Applied^™ Picosun^™ Sprinter^™ is made in Finland with European vacuum robotics and process modules.