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Products & Services
Products & Technologies
Services
Resources
Contact
Future of Advanced Packaging: Industry Insights on Co-Innovation and Talent Development
Perspective • February 3, 2026
Advancing Chip Performance with 30 Years of Wiring Leadership
Perspective • January 23, 2026
Co-optimized Process and Metrology Accelerates Molybdenum Contact Development
Perspective • January 5, 2026
Jensen Huang in Conversation with Gary Dickerson on the Evolution of AI
Applied Materials Hosts Lively Debate on AI Energy Efficiency
Applied Materials Earns TSMC’s Excellent Performance Awards
A Quantum Leap: Celebrating Dr. John Martinis and the Future of Computing
A New Chapter in the Applied Materials Brand
HBM Memory Demands eBeam Metrology
Applied Materials to Report Fiscal First Quarter 2026 Results on Feb. 12, 2026
Applied Materials Announces Cash Dividend
Applied Materials to Participate at UBS Global Technology and AI Conference
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