Industry Conferences and Events

Electronics Packaging Technology Conference

Date

Presentation

Presenter

Location

December 5, 2023Die-to-Wafer Hybrid bonding to address next-gen Electronics Packaging ChallengesAvi ShantaramGrand Ballroom 
December 5, 2023Panel Session 1: Chiplets IntegrationArvind SundarrajanGrand Ballroom 
December 5, 2023Panel Session 2: Artificial Intelligence for Package Design and ManufacturingVincent DicaprioGrand Ballroom 

IEEE International Electron Devices Meeting

Date

Presentation

Presenter

Location

December 12, 2023Tungsten Interconnect Resistance Reduction Enabling Energy Efficient and High Performance Applications for 2nm Node and BeyondGaurav Thareja et al.Continental 4
December 12, 2023Sustainability-Aware Technology Development at Applied MaterialsBen Gross, E. Neville Reyes, S. KapadiaGrand Ballroom A
December 12, 2023AI: Semiconductor Catalyst? Or Disrupter?Anantha Sethuraman 

SEMICON Japan
December 13 – 15, 2023

Date

Presentation

Presenter

Location

December 13, 2023Enabling Semiconductor Scaling through 3D Materials EngineeringEllie YiehEast Hall, SuperTHEATER

Past Events

SEMICON Europa
November 15 – 16, 2023

Date

Presentation

Presenter

Location

November 15, 2023Rethinking Automation CultureChris ReevesExecutive Forum, Hall B2
November 15, 2023Continuous Sustainability Improvements in Subfab Operation Using Advanced Communication Capabilities as a Cooperative Effort of Multiple StakeholdersAndreas NeuberICM Munich, Room 14a 
November 16, 2023The Road to High Volume Manufacturing: Applied Materials Solutions for Silicon CarbideDavid Britz
 
Executive Forum, Hall B2

Presented by Applied Materials: Presentation and Discussions at SEMICON West 2023

Wednesday, July 12

Time

Presentation

Presenter and Role

Location

8:30am -
10:45am PT
CEO Summit: Path to Net ZeroPresenter:
Gary Dickerson, President and Chief Executive Officer
Keynote Stage, Room 24, North Lower Lobby
10:30am -
12:30pm PT
Smart Mobility – Meeting The Demands of Affordable ElectrificationPanel Moderator:
Gopal Prabhu, Strategy & Business, ICAPS
Smart Mobility Stage, Moscone South 
11:00am - 11:25am PTTales from Interns and Recent GraduatesPresenter:
Isabel Chapa, Applied Physics Intern
 
Workforce Development Theater, Moscone North, Exhibition Level, Hall F
12:35pm -
12:35pm PT
Smart Manufacturing: EcoTwin - An Integrated Solution for Sustainability in Semiconductor ManufacturingPresenter:
Ala Moradian, CAE Programs & Digital Twins Lead, Director
Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F
2:00pm -
4:14pm PT
Smart Mobility – Intelligent Sensors for Smart MobilityPanel Moderator:
Shiva Rai, Director of Technology, Compound Semiconductors & Photonics, ICAPS
Smart Mobility Stage, Moscone South
2:00pm - 
2:25pm
Opportunities from Failure – A Day in the Life of an EngineerPresenter:
Alison Nalven, Account Manager
Workforce Development Theater, Moscone North, Exhibition Level, Hall F
2:30pm-
2:55pm
SEMI PFAS WG Focus on Equipment and ArticlesPresenter:
Ben Gross, Chemist
Moscone North, Exhibition Level,
Room 20-21
3:05pm-
3:25pm
Creating a Cyber Resilient Semi Industry TogetherPresenter:
Kannan Perumal, VP and Chief Information Security Officer
Moscone North, Exhibition Level,
Room 21

Thursday, July 13

10:35am - 10:50am PTSmart Mobility – Connecting Automotive to SiC ManufacturingPresenter:
David Britz, Head of Strategic Marketing for ICAPS
Moscone North, Exhibition Level,
Room 21
10:55am -
11:15am PT
Three Innovations in Ebeam Technology to Accelerate EUV Lithography, Gate-All-Around Transistors and High Aspect Ratio Memories & InterconnectsPresenter:
Ofer Adan, Sr. Director of Tech Collaborations and Strategic Business Development, Imaging and Process Control Group
TechTalk Stage, Moscone South, Exhibition Level, Room 4
1:30pm -
1:50pm PT
Die-to-Wafer Hybrid Bonding to address Next-Gen Electronics Packaging Challenges

Presenter:

Avi Shantaram, Business Development & Kinex Global Product Director, Advanced Packaging

Moscone South, Exhibition Level,
Room 11