Industry Conferences

News and Media
News and Media




May 21 – 24

International Memory Workshop (IMW) – Premier Sponsor

Materials Enabled Memory Scaling and New Architectures
Invited Speaker: Bala Haran

Panel Discussion: “Can 3D structuring be a technology driver for memory like it was for NAND?"
Panelist: Sony Varghese

May 22 – 25

International Interconnect Technology Conference (IITC) – Silver Sponsor

From Microns to Nanometers: Overcoming the Challenges of Scaling Interconnects
Keynote Speaker: Sundar Ramamurthy
May 23 – 25SEMICON Southeast Asia (SEA) – Gold Sponsor 
May 28 – June 1International Symposium on Power Semiconductor Devices and ICs (ISPSD) – Silver Sponsor 
May 30 – June 2Electronic Components and Technology Conference (ECTC)

Development of Copper Thermal Coefficient for Low Temperature Hybrid Bonding
Author: Sefa Dag et al.

Aggressive Pitch Scaling (Sub-0.5 µm) of W2W Hybrid Bonding Through Novel Materials and Process Innovations
Author: Tyler Sherwood et al.

0.5 µm Pitch Wafer-to-Wafer Hybrid Bonding With SiCN Bonding Interface for Advanced Memory
Author: Kia Ma et al.

Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking Using Cu-Cu Hybrid Bonding
Author: Prayudi Lianto et al.

May 30 – June 2International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication​ (EIPBN)

Rapid prototyping of etch test structures for hard mask development using electron beam lithography

Author: Barbara Kazanowska et al.






June 11 – 16

Symposium on VLSI Technology and Circuits

Materials to Systems Co-Optimization: Accelerating Technological Innovations
Workshop Presenter: Buvna Ayyagari-Sangamalli

Process Technology (Incl. Equipment) for adv. Logic, Non-BEOL
Short Course Speaker: Naomi Yoshida

Contact Cavity Shaping and Selective SiGe:B Low-Temperature Epitaxy Process Solution for Sub 10-9 Ω.cm2 Contact Resistivity in Nonplanar FETs
Nicolas Breil et al.

BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond
Author: Gaurav Thareja et al.

June 19 – 21

European Mask and Lithography Conference (EMLC) – Coffee Break Sponsor

June 27 – 29Leti Innovation Days – Bronze Sponsor 
June 29 – July 1SEMICON China – Sponsor 






July 22 – 26

International Conference on Atomic Layer Deposition (ALD) – Silver Sponsor

Halide-free, Low Melting, Volatile, Thermally Stable Mo(0) Precursors for ALD of Mo films
Author: Chandan Kr Barik et al.

Precursors and Processes for the Atomic Layer Deposition of Bismuth Metal Thin Films
Author: Zachary Devereaux et al.

Advances in the Industrial Adoption of Selective ALD Processes
Invited Speaker: David Thompson

Elucidating the Role of Functional Groups of Ligands for Selective Metal Blocking via Vapor-Phase Sam Deposition
Author: Chandan Das et al.

Revealing Process-Structure Relationships for ALD Amorphous Oxide Semiconductors with XANES and First-Principles Modeling
Author: Orlando Trejo et al.