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IEEE Electron Devices Technology and Manufacturing Conference
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Date | Presentation | Presenter | Location |
March 3, 2024 | Logic Technology Roadmap | Gaurav Thareja | East Hall, SuperTHEATER |
March 4, 2024 | ComputLitho – An Indigenous Optical Lithography Simulator with Novel Features | Pardeep Kumar | TBD |
Enabling Next Generation CMOS Scaling Through Materials Engineering and Process Technology | Mehul Naik | TBD | |
Semiconductor Fabs & Sustainability | Neela Ayalasomayajula | TBD | |
March 5, 2024 | GAA Technology Innovations for 2nm Logic node and Beyond | El Mehidi Bazizi | TBD |
Coupling Reactor-scale and Feature-Scale Simulations: ProcessTwin™ for Unit Processes | Rajesh Sathiyanarayanan | TBD | |
Evolution of Maskless Digital Lithography A game-changer for Advanced | Ashwini Aggarwal | TBD | |
March 6, 2024 | e-beam technology innovation for EUV, Gate all around logic and Advance Memory acceleration | Nitin Singh Malik | TBD |
Roughness as an Important Metric for Si and SiGe Epi Growth | Yogendra Yadav | TBD |
China Semiconductor Technology International Conference
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Date | Presentation | Presenter | Location |
March 17, 2024 | Integrated Module Approach to Solutions in the Specialty Device Market | Michael Chudzik | 3rd Floor Auditorium |
Tailoring the deposition and composition of advanced oxide and SiCN films to deliver the highest bonding energy for fusion and hybrid bonding applications | Zongbin Wang | 5th Floor Yangtze River Hall | |
Novel Etch Solution with Sym3 for Logic BEOL Patterning Etch Applications | Hui Sun | 3rd Floor (3H+3I+3J) |
IMAPS Device Packaging Conference
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Date | Presentation | Presenter | Location |
March 19, 2024 | Materials-Technology Co-Optimization (MTCO) for Inter-Die-Gap-Fill (IDGF) in Heterogeneous Integration of Chiplets (TA1) | Sean Seutter et al. | TBD |
SPIE Advanced Lithography
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Date | Presentation | Presenter | Location |
February 27, 2024 | Enabling a superior augmented reality experience with high performance waveguides | Ludovic Godet | Grand Ballroom 220C |
Pattern shaping optimization and applications | Yung-Chen Lin | Room 211B | |
Real time EPE measurement as a yield correlated metrology on advanced DRAM nodes | Michael Shifrin (Israel) | Hall 2 | |
February 28, 2024 | Performance comparison of photosensitive polyimides for high resolution dual damascene schemes for FOWLP packaging applications | Luisa D. Bozano | Grand Ballroom 220C |
Low landing energy as an enabler for optimal contour based OPC modeling in the EUV era, The importance of less damaging and surface sensitive metrology to identify true EUV process monitoring | Ran Alkoken (Israel) | Grand Ballroom 220B | |
Matching in a data-driven world | Mor Baram (Israel) | Grand Ballroom 220B | |
Engineering functional resist underlayers to reduce LWR, minimum cd, and dose for chemically amplified resist, Enabling high resolution pillar patterning using metal oxide resist by functional underlayer design | Sudha Rathi | Hall 2 | |
B-spline and Bézier curvilinear representations: a comparative study | Benjamin Venitucci (France) | Hall 2 | |
February 29, 2024 | New ecosystems of metrology, inspection and test are needed for advanced packaging heterogenous integration | Ofer Adan (Israel) | Grand Ballroom 220B |
International Wafer-Level Packaging Conference
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Date | Presentation | Presenter | Location |
February 14, 2024 | Advanced Bonding Films for 3D Wafer Level Integration | Doug Lee | TBD |
Chiplet Summit
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Date | Presentation | Presenter | Location |
February 7, 2024 | Keynote 1: Applied Materials | Subi Kengeri | Great America Ballroom J |
SEMICON Korea 2024년 1월 31일(수) - 2월 2일(금) COEX(코엑스) | |||
일시 | 발표 | 연사 | 위치 |
1월 31일(수) | S2. Advanced Materials & Process Technology Overlay and Wafer Shape Control in Semiconductor Manufacturing | Pradeep Subrahmanyan | 308, 3F |
2월 1일(목) | MI Forum Novel Technology in Defect Review Enables Yield-limiting-defects Inspection of EUV and 3D Gate-All-Around Smaller and Buried Defects | Sarvesh Mundra | 402, 4F |
2월 1일(목) | S4. Plasma Science and Etching Technology Enabling Dry Etching of sub-10 Nm Features at Cryogenic Temperature | Sumit Agarwal | 307, 3F |
2월 2일(금) | Women-in-Technology Great Place to Work in Career Journey | Jungsun Jessie Kim | 401, 4F |
2월 2일(금) | Meet the Experts! Road to Customer Engineers in the Semiconductor Industry | Bobae Lee | 401, 4F |
Electronics Packaging Technology Conference
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Date | Presentation | Presenter | Location |
December 5, 2023 | Die-to-Wafer Hybrid bonding to address next-gen Electronics Packaging Challenges | Avi Shantaram | Grand Ballroom |
December 5, 2023 | Panel Session 1: Chiplets Integration | Arvind Sundarrajan | Grand Ballroom |
December 5, 2023 | Panel Session 2: Artificial Intelligence for Package Design and Manufacturing | Vincent Dicaprio | Grand Ballroom |
IEEE International Electron Devices Meeting | |||
Date | Presentation | Presenter | Location |
December 12, 2023 | Tungsten Interconnect Resistance Reduction Enabling Energy Efficient and High Performance Applications for 2nm Node and Beyond | Gaurav Thareja et al. | Continental 4 |
December 12, 2023 | Sustainability-Aware Technology Development at Applied Materials | Ben Gross, E. Neville Reyes, S. Kapadia | Grand Ballroom A |
December 12, 2023 | AI: Semiconductor Catalyst? Or Disrupter? | Anantha Sethuraman |
SEMICON Japan
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Date | Presentation | Presenter | Location |
December 13, 2023 | Enabling Semiconductor Scaling through 3D Materials Engineering | Ellie Yieh | East Hall, SuperTHEATER |
SEMICON Europa
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Date | Presentation | Presenter | Location |
November 15, 2023 | Rethinking Automation Culture | Chris Reeves | Executive Forum, Hall B2 |
November 15, 2023 | Continuous Sustainability Improvements in Subfab Operation Using Advanced Communication Capabilities as a Cooperative Effort of Multiple Stakeholders | Andreas Neuber | ICM Munich, Room 14a |
November 16, 2023 | The Road to High Volume Manufacturing: Applied Materials Solutions for Silicon Carbide | David Britz | Executive Forum, Hall B2 |
Presented by Applied Materials: Presentation and Discussions at SEMICON West 2023Wednesday, July 12 | |||
Time | Presentation | Presenter and Role | Location |
8:30am - | Presenter: | Keynote Stage, Room 24, North Lower Lobby | |
10:30am - | Smart Mobility – Meeting The Demands of Affordable Electrification | Panel Moderator: | Smart Mobility Stage, Moscone South |
11:00am - 11:25am PT | Presenter: | Workforce Development Theater, Moscone North, Exhibition Level, Hall F | |
12:35pm - | Presenter: | Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F | |
2:00pm - | Panel Moderator: | Smart Mobility Stage, Moscone South | |
2:00pm - | Opportunities from Failure – A Day in the Life of an Engineer | Presenter: | Workforce Development Theater, Moscone North, Exhibition Level, Hall F |
2:30pm- | Presenter: | Moscone North, Exhibition Level, | |
3:05pm- | Presenter: | Moscone North, Exhibition Level, | |
Thursday, July 13 | |||
10:35am - 10:50am PT | Presenter: | Moscone North, Exhibition Level, | |
10:55am - | Presenter: | TechTalk Stage, Moscone South, Exhibition Level, Room 4 | |
1:30pm - | Die-to-Wafer Hybrid Bonding to address Next-Gen Electronics Packaging Challenges | Presenter: Avi Shantaram, Business Development & Kinex Global Product Director, Advanced Packaging | Moscone South, Exhibition Level, |