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Resources
Electronics Packaging Technology Conference
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Date | Presentation | Presenter | Location |
December 5, 2023 | Die-to-Wafer Hybrid bonding to address next-gen Electronics Packaging Challenges | Avi Shantaram | Grand Ballroom |
December 5, 2023 | Panel Session 1: Chiplets Integration | Arvind Sundarrajan | Grand Ballroom |
December 5, 2023 | Panel Session 2: Artificial Intelligence for Package Design and Manufacturing | Vincent Dicaprio | Grand Ballroom |
IEEE International Electron Devices Meeting | |||
Date | Presentation | Presenter | Location |
December 12, 2023 | Tungsten Interconnect Resistance Reduction Enabling Energy Efficient and High Performance Applications for 2nm Node and Beyond | Gaurav Thareja et al. | Continental 4 |
December 12, 2023 | Sustainability-Aware Technology Development at Applied Materials | Ben Gross, E. Neville Reyes, S. Kapadia | Grand Ballroom A |
December 12, 2023 | AI: Semiconductor Catalyst? Or Disrupter? | Anantha Sethuraman |
SEMICON Japan
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Date | Presentation | Presenter | Location |
December 13, 2023 | Enabling Semiconductor Scaling through 3D Materials Engineering | Ellie Yieh | East Hall, SuperTHEATER |
SEMICON Europa
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Date | Presentation | Presenter | Location |
November 15, 2023 | Rethinking Automation Culture | Chris Reeves | Executive Forum, Hall B2 |
November 15, 2023 | Continuous Sustainability Improvements in Subfab Operation Using Advanced Communication Capabilities as a Cooperative Effort of Multiple Stakeholders | Andreas Neuber | ICM Munich, Room 14a |
November 16, 2023 | The Road to High Volume Manufacturing: Applied Materials Solutions for Silicon Carbide | David Britz | Executive Forum, Hall B2 |
Presented by Applied Materials: Presentation and Discussions at SEMICON West 2023Wednesday, July 12 | |||
Time | Presentation | Presenter and Role | Location |
8:30am - 10:45am PT | CEO Summit: Path to Net Zero | Presenter: Gary Dickerson, President and Chief Executive Officer | Keynote Stage, Room 24, North Lower Lobby |
10:30am - 12:30pm PT | Smart Mobility – Meeting The Demands of Affordable Electrification | Panel Moderator: Gopal Prabhu, Strategy & Business, ICAPS | Smart Mobility Stage, Moscone South |
11:00am - 11:25am PT | Tales from Interns and Recent Graduates | Presenter: Isabel Chapa, Applied Physics Intern | Workforce Development Theater, Moscone North, Exhibition Level, Hall F |
12:35pm - 12:35pm PT | Smart Manufacturing: EcoTwin - An Integrated Solution for Sustainability in Semiconductor Manufacturing | Presenter: Ala Moradian, CAE Programs & Digital Twins Lead, Director | Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F |
2:00pm - 4:14pm PT | Smart Mobility – Intelligent Sensors for Smart Mobility | Panel Moderator: Shiva Rai, Director of Technology, Compound Semiconductors & Photonics, ICAPS | Smart Mobility Stage, Moscone South |
2:00pm - 2:25pm | Opportunities from Failure – A Day in the Life of an Engineer | Presenter: Alison Nalven, Account Manager | Workforce Development Theater, Moscone North, Exhibition Level, Hall F |
2:30pm- 2:55pm | SEMI PFAS WG Focus on Equipment and Articles | Presenter: Ben Gross, Chemist | Moscone North, Exhibition Level, Room 20-21 |
3:05pm- 3:25pm | Creating a Cyber Resilient Semi Industry Together | Presenter: Kannan Perumal, VP and Chief Information Security Officer | Moscone North, Exhibition Level, Room 21 |
Thursday, July 13 | |||
10:35am - 10:50am PT | Smart Mobility – Connecting Automotive to SiC Manufacturing | Presenter: David Britz, Head of Strategic Marketing for ICAPS | Moscone North, Exhibition Level, Room 21 |
10:55am - 11:15am PT | Three Innovations in Ebeam Technology to Accelerate EUV Lithography, Gate-All-Around Transistors and High Aspect Ratio Memories & Interconnects | Presenter: Ofer Adan, Sr. Director of Tech Collaborations and Strategic Business Development, Imaging and Process Control Group | TechTalk Stage, Moscone South, Exhibition Level, Room 4 |
1:30pm - 1:50pm PT | Die-to-Wafer Hybrid Bonding to address Next-Gen Electronics Packaging Challenges | Presenter: Avi Shantaram, Business Development & Kinex Global Product Director, Advanced Packaging | Moscone South, Exhibition Level, Room 11 |