Industry Conferences

Electronics Packaging Technology Conference
Date	Presentation	Presenter	Location
December 5, 2023	Die-to-Wafer Hybrid bonding to address next-gen Electronics Packaging Challenges	Avi Shantaram	Grand Ballroom
December 5, 2023	Panel Session 1: Chiplets Integration	Arvind Sundarrajan	Grand Ballroom
December 5, 2023	Panel Session 2: Artificial Intelligence for Package Design and Manufacturing	Vincent Dicaprio	Grand Ballroom

IEEE International Electron Devices Meeting
Date	Presentation	Presenter	Location
December 12, 2023	Tungsten Interconnect Resistance Reduction Enabling Energy Efficient and High Performance Applications for 2nm Node and Beyond	Gaurav Thareja et al.	Continental 4
December 12, 2023	Sustainability-Aware Technology Development at Applied Materials	Ben Gross, E. Neville Reyes, S. Kapadia	Grand Ballroom A
December 12, 2023	AI: Semiconductor Catalyst? Or Disrupter?	Anantha Sethuraman

SEMICON Japan December 13 – 15, 2023
Date	Presentation	Presenter	Location
December 13, 2023	Enabling Semiconductor Scaling through 3D Materials Engineering	Ellie Yieh	East Hall, SuperTHEATER

Past Events

SEMICON Europa November 15 – 16, 2023
Date	Presentation	Presenter	Location
November 15, 2023	Rethinking Automation Culture	Chris Reeves	Executive Forum, Hall B2
November 15, 2023	Continuous Sustainability Improvements in Subfab Operation Using Advanced Communication Capabilities as a Cooperative Effort of Multiple Stakeholders	Andreas Neuber	ICM Munich, Room 14a
November 16, 2023	The Road to High Volume Manufacturing: Applied Materials Solutions for Silicon Carbide	David Britz	Executive Forum, Hall B2

Presented by Applied Materials: Presentation and Discussions at SEMICON West 2023 Wednesday, July 12
Time	Presentation	Presenter and Role	Location
8:30am - 10:45am PT	CEO Summit: Path to Net Zero	Presenter: Gary Dickerson, President and Chief Executive Officer	Keynote Stage, Room 24, North Lower Lobby
10:30am - 12:30pm PT	Smart Mobility – Meeting The Demands of Affordable Electrification	Panel Moderator: Gopal Prabhu, Strategy & Business, ICAPS	Smart Mobility Stage, Moscone South
11:00am - 11:25am PT	Tales from Interns and Recent Graduates	Presenter: Isabel Chapa, Applied Physics Intern	Workforce Development Theater, Moscone North, Exhibition Level, Hall F
12:35pm - 12:35pm PT	Smart Manufacturing: EcoTwin - An Integrated Solution for Sustainability in Semiconductor Manufacturing	Presenter: Ala Moradian, CAE Programs & Digital Twins Lead, Director	Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F
2:00pm - 4:14pm PT	Smart Mobility – Intelligent Sensors for Smart Mobility	Panel Moderator: Shiva Rai, Director of Technology, Compound Semiconductors & Photonics, ICAPS	Smart Mobility Stage, Moscone South
2:00pm - 2:25pm	Opportunities from Failure – A Day in the Life of an Engineer	Presenter: Alison Nalven, Account Manager	Workforce Development Theater, Moscone North, Exhibition Level, Hall F
2:30pm- 2:55pm	SEMI PFAS WG Focus on Equipment and Articles	Presenter: Ben Gross, Chemist	Moscone North, Exhibition Level, Room 20-21
3:05pm- 3:25pm	Creating a Cyber Resilient Semi Industry Together	Presenter: Kannan Perumal, VP and Chief Information Security Officer	Moscone North, Exhibition Level, Room 21
Thursday, July 13
10:35am - 10:50am PT	Smart Mobility – Connecting Automotive to SiC Manufacturing	Presenter: David Britz, Head of Strategic Marketing for ICAPS	Moscone North, Exhibition Level, Room 21
10:55am - 11:15am PT	Three Innovations in Ebeam Technology to Accelerate EUV Lithography, Gate-All-Around Transistors and High Aspect Ratio Memories & Interconnects	Presenter: Ofer Adan, Sr. Director of Tech Collaborations and Strategic Business Development, Imaging and Process Control Group	TechTalk Stage, Moscone South, Exhibition Level, Room 4
1:30pm - 1:50pm PT	Die-to-Wafer Hybrid Bonding to address Next-Gen Electronics Packaging Challenges	Presenter: Avi Shantaram, Business Development & Kinex Global Product Director, Advanced Packaging	Moscone South, Exhibition Level, Room 11