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Date(s) | Conference | Presentation |
| International Memory Workshop (IMW) – Premier Sponsor | Materials Enabled Memory Scaling and New Architectures Panel Discussion: “Can 3D structuring be a technology driver for memory like it was for NAND?" | |
International Interconnect Technology Conference (IITC) – Silver Sponsor | From Microns to Nanometers: Overcoming the Challenges of Scaling Interconnects Keynote Speaker: Sundar Ramamurthy | |
| May 23 – 25 | SEMICON Southeast Asia (SEA) – Gold Sponsor | |
| May 28 – June 1 | International Symposium on Power Semiconductor Devices and ICs (ISPSD) – Silver Sponsor | |
| May 30 – June 2 | Electronic Components and Technology Conference (ECTC) | Development of Copper Thermal Coefficient for Low Temperature Hybrid Bonding Aggressive Pitch Scaling (Sub-0.5 µm) of W2W Hybrid Bonding Through Novel Materials and Process Innovations 0.5 µm Pitch Wafer-to-Wafer Hybrid Bonding With SiCN Bonding Interface for Advanced Memory Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking Using Cu-Cu Hybrid Bonding |
| May 30 – June 2 | International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication (EIPBN) | Rapid prototyping of etch test structures for hard mask development using electron beam lithography Author: Barbara Kazanowska et al. |
Date(s) | Conference | Presentation |
June 11 – 16 | Symposium on VLSI Technology and Circuits | Materials to Systems Co-Optimization: Accelerating Technological Innovations Process Technology (Incl. Equipment) for adv. Logic, Non-BEOL Contact Cavity Shaping and Selective SiGe:B Low-Temperature Epitaxy Process Solution for Sub 10-9 Ω.cm2 Contact Resistivity in Nonplanar FETs BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond |
June 19 – 21 | European Mask and Lithography Conference (EMLC) – Coffee Break Sponsor | |
| June 27 – 29 | Leti Innovation Days – Bronze Sponsor | |
| June 29 – July 1 | SEMICON China – Sponsor |
Date(s) | Conference | Presentation |
July 22 – 26 | International Conference on Atomic Layer Deposition (ALD) – Silver Sponsor | Halide-free, Low Melting, Volatile, Thermally Stable Mo(0) Precursors for ALD of Mo films Precursors and Processes for the Atomic Layer Deposition of Bismuth Metal Thin Films Advances in the Industrial Adoption of Selective ALD Processes Elucidating the Role of Functional Groups of Ligands for Selective Metal Blocking via Vapor-Phase Sam Deposition Revealing Process-Structure Relationships for ALD Amorphous Oxide Semiconductors with XANES and First-Principles Modeling |