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Impact 2025
504B, 5F, Nangang Exhibition Center Hall 1, Taipei, Taiwan

Date Time Presentation Presenter
October 21, 2025 15:30-15:35 PM Forum Moderator Opening Albert Lan (Global Senior Packing Account TD Head)
October 21, 2025 15:35-15:40 PM Opening Remarks Vincent DiCaprio (Vice President, Business Development)
October 21, 2025 16:30-16:50 PM Panel tool (PVD/ ETCH) Naresh Kumar Asokan (Global Product Manager, Panel Packaging and Solutions Group)
October 21, 2025 16:50-17:10 PM Enabling AI-Era High Performance Computing with Digital Lithography Jang Fung Chen, Ph.D. (Vice President, Digital Lithography Group
October 21, 2025 17:10-17:30 PM Advanced Packaging M&I Challenges addressed by Electron Beam Technology Bernhard Mueller (Senior Director, R&D)

 

SEMICON Taiwan
Taipei Nangang Exhibition Center Hall 1&2

Monday, September 8

Time Presentation Presenter, Role Location
14:15 – 14:40 Advancing FOPLP Development Through Innovative Solutions, Materials and Yield Optimization CEO Summit
Digital Lithography for Trillion-Transistor AI Device Packaging: Enabling Scalable Integration		 Jang Fung Chen, Ph.D. (Vice President, Digital Lithography Group) 701GH, 7F, Taipei Nangang Exhibition Center Hall 2

Tuesday, September 9

Time Presentation Presenter, Role Location
10:20 – 10:40 AI-Driven Technologies: Powering the Next-Gen Semiconductor Era
Enabling Next-Gen AI: Innovations in Logic Devices and Materials for 2nm and Beyond		 Gaurav Thareja, Ph.D. (Director and Head of Process Integration, Semiconductor Products Group) 701C, 7F, Taipei Nangang Exhibition Center Hall 2

Wednesday, September 10

Time Presentation Presenter, Role Location
11:35 – 12:00 Driving Global Momentum in Sustainable Semiconductors – Innovation. Collaboration. Impact.
Accelerating Net Zero for Semiconductor Manufacturing
Newsroom Perspective: The ecoUP™ Portfolio: Paving the Path to a Sustainable Future		 Nasreen Chopra, Ph.D. (Vice President , Sustainability Systems Engineering, Semiconductor Products Group) 401, 4F, Taipei Nangang Exhibition Center Hall 1

Friday, September 12

Time Presentation Presenter, Role Location
11:05 – 11:25 AI Packaging Supply Chain Ecosystem & Driving Technology
Inflections In Advanced Packaging Technologies- From Complexity to Manufacturability		 Shin-Puu Jeng, Ph.D. (Vice President, Engineering, Semiconductor Products Group) 701GH, 7F, Taipei Nangang Exhibition Center Hall 2

 

International Smart Display Application Conference 2025
Taipei, Taiwan
Date Presentation Presenter
April 16, 2025 Revolutionizing OLED Display Manufacturing with MAX OLED Solution Louis Cheng, Taiwan Account General Manager, Display Group