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SEMICON Taiwan
TaiNEX 1 & 2 ｜Grand Hilai Taipei｜Grand Luxe Banquet
Taipei, Taiwan

Monday, August 31

Time Presentation Presenter, Role Location
11:10 - 11:35 IC Forum
AI at Scale: Breaking the Energy Wall with Heterogeneous Integration		 Ashok Muthukumaran (Senior Director, Semiconductor Products Group) Platinum Ballroom C, 3F, Grand Hilai Taipei
14:15 - 14:40 FOPLP Forum
Advanced Patterning in FOPLP: A Scalable Digital Lithography Platform and Co-Optimized Process Integration		 Anant Chimmalgi (General Manager, Digital Lithography Group) Grand Ballroom, 3F, Grand Luxe Banquet

Tuesday, September 1

Time Presentation Presenter, Role Location
10:05 - 10:30 Smart Manufacturing Forum
From Automation to Autonomy – Agentic AI for Yield Management		 Mingyuan Zhao (Senior Manager, Strategic Marketing, Automation Products Group) Luxury Ballroom, 3F, Grand Luxe Banquet

Friday, September 4

Time Presentation Presenter, Role Location
08:30 - 15:30 Heterogeneous Integration Global Summit Day 3
AI Packaging Supply Chain Ecosystem & Driving Technology		 Albert Lan (Forum Chair and Moderator, Senior Technical Director, Semiconductor Products Group) Grand Ballroom, 3F, Grand Luxe Banquet
10:50 - 11:15 Heterogeneous Integration Global Summit Day 3
Enabling the Next Era of Heterogeneous Integration with Panel-Level Packaging Innovation and Commercialization		 Michael Rosshirt (Account Technologist Director, Semiconductor Products Group) Grand Ballroom, 3F, Grand Luxe Banquet