SEMICON Taiwan Platinum Sponsor

August 31 - September 4, 2026

Applied Materials at SEMICON Taiwan 2026

As AI drives new demands across the semiconductor ecosystem, material innovation is critical to enabling energy-efficient chips and advancing technologies.

Join Applied Materials' keynote sessions at SEMICON Taiwan to discover how we collaborate across the ecosystem to accelerate next-generation innovation.

Monday, August 31

Time Presentation Presenter, Role Location
13:00 - 17:00 FOPLP Forum Anant Chimmalgi, Ph.D. (General Manager, Digital Lithography Group) Grand Ballroom, 3F, Grand Luxe Banquet
08:30 - 16:55 IC Forum
AI at Scale: Breaking the Energy Wall with Heterogeneous Integration
Ashok Muthukumaran, (Senior Director, Semiconductor Products Group) Platinum Ballroom C, 3F, Grand Hilai Taipei

Tuesday, September 1

Time Presentation Presenter, Role Location
08:30 - 16:45 Smart Manufacturing Forum
From Automation to Autonomy – Agentic AI for Yield Management
Ming Zhao (Senior Manager, Strategic Marketing, Automation Products Group) Luxury Ballroom, 3F, Grand Luxe Banquet

Friday, September 4

Time Presentation Presenter, Role Location
08:30 - 15:30 Heterogeneous Integration Global Summit
AI Packaging Supply Chain Ecosystem & Driving Technology
Albert Lan, Ph.D. (Forum Chair and Moderator, Global Senior Packaging Account TD Head) Grand Ballroom, 3F, Grand Luxe Banquet
08:30 - 15:30 Heterogeneous Integration Global Summit Michael Rosshirt (Account Technologist Director, Semiconductor Products Group) Grand Ballroom, 3F, Grand Luxe Banquet