SEMICON Taiwan Platinum Sponsor

August 31 - September 4, 2026

Applied Materials at SEMICON Taiwan 2026

As AI drives new demands across the semiconductor ecosystem, material innovation is critical to enabling energy-efficient chips and advancing technologies.

Join Applied Materials' keynote sessions at SEMICON Taiwan to discover how we collaborate across the ecosystem to accelerate next-generation innovation.

Monday, August 31

Time Presentation Presenter, Role Location
11:10 - 11:35 IC Forum
AI at Scale: Breaking the Energy Wall with Heterogeneous Integration
Ashok Muthukumaran, (Senior Director, Semiconductor Products Group) Platinum Ballroom C, 3F, Grand Hilai Taipei
14:15 - 14:40 FOPLP Forum
Advanced Patterning in FOPLP: A Scalable Digital Lithography Platform and Co-Optimized Process Integration
Anant Chimmalgi, Ph.D. (General Manager, Digital Lithography Group) Grand Ballroom, 3F, Grand Luxe Banquet

Tuesday, September 1

Time Presentation Presenter, Role Location
10:05 - 10:30 Smart Manufacturing Forum
From Automation to Autonomy – Agentic AI for Yield Management
Mingyuan Zhao (Senior Manager, Strategic Marketing, Automation Products Group) Luxury Ballroom, 3F, Grand Luxe Banquet

Friday, September 4

Time Presentation Presenter, Role Location
08:30 - 15:30 Heterogeneous Integration Global Summit
AI Packaging Supply Chain Ecosystem & Driving Technology
Albert Lan, Ph.D. (Forum Chair and Moderator, Global Senior Packaging Account TD Head) Grand Ballroom, 3F, Grand Luxe Banquet
10:50 - 11:15 Heterogeneous Integration Global Summit
Enabling the Next Era of Heterogeneous Integration with Panel-Level Packaging Innovation and Commercialization
Michael Rosshirt (Account Technologist Director, Semiconductor Products Group) Grand Ballroom, 3F, Grand Luxe Banquet