Ginestra® Software address your mainstream and emerging technology needs

backgroundImage

Mainstream Technologies

3D NAND

Material innovations and stack engineering enabling cell scaling and performance improvements

Technical Brochure

DRAM → 3D DRAM

Material stack engineering for DRAM and 3D DRAM cell scaling and optimization
 

Technical Brochure

FinFET → GAA

HKMG stack engineering and metrology supporting FinFET to 3D GAA/nanosheet transition

Technical Brochure

Emerging Technologies

Phase Change Memory

Captures full physics of chalcogenide materials to enable Phase Change Memory (PCM) scaling

 

Technical Brochure

Ovonic Threshold

Full physical/defect-centric model to enable Ovonic Threshold Switching (OTS) selector optimization for advanced memories

Technical Brochure

Resistive RAM

Reproduce ion/vacancy diffusion, chemical reactions, statistics for AI applications

 

 

Technical Brochure

Ferroelectric

Materials and atomic defect focus to unlock ferroelectric device (FeFET, FRAM) performance and reliability
 

Technical Brochure

Solve your materials and stack engineering challenges