SEMICON Taiwan Platinum Sponsor

September 8 - 12, 2025

Applied Materials at SEMICON Taiwan 2025

This year, the industry will come together to explore the next-generation breakthroughs—from materials innovation and advanced packaging to sustainable semiconductor manufacturing technologies that enable energy-efficient chips powering AI.

Make sure to attend the keynote speech to learn how we co-innovate at high velocity with our partners. We deliver material innovation that changes the world.

Taipei Nangang Exhibition Center Hall 1&2

Monday, September 8

Time Presentation Presenter, Role Location
14:15 – 14:40 Advancing FOPLP Development Through Innovative Solutions, Materials and Yield Optimization CEO Summit
Digital Lithography for Trillion-Transistor AI Device Packaging: Enabling Scalable Integration
Jang Fung Chen, Ph.D. (Vice President, Digital Lithography Group) 701GH, 7F, Taipei Nangang Exhibition Center Hall 2

Tuesday, September 9

Time Presentation Presenter, Role Location
10:20 – 10:40 AI-Driven Technologies: Powering the Next-Gen Semiconductor Era
Enabling Next-Gen AI: Innovations in Logic Devices and Materials for 2nm and Beyond
Gaurav Thareja, Ph.D. (Director and Head of Process Integration, Semiconductor Products Group) 701C, 7F, Taipei Nangang Exhibition Center Hall 2

Wednesday, September 10

Time Presentation Presenter, Role Location
11:35 – 12:00 Driving Global Momentum in Sustainable Semiconductors – Innovation. Collaboration. Impact.
Accelerating Net Zero for Semiconductor Manufacturing
Nasreen Chopra, Ph.D. (Vice President , Sustainability Systems Engineering, Semiconductor Products Group) 401, 4F, Taipei Nangang Exhibition Center Hall 1

Friday, September 12

Time Presentation Presenter, Role Location
11:05 – 11:25 AI Packaging Supply Chain Ecosystem & Driving Technology
Infractions In Advanced Packaging Technologies- From Complexity to Manufacturability
Shin-puu Jeng, Ph.D. (Vice President, Engineering, Semiconductor Products Group) 701GH, 7F, Taipei Nangang Exhibition Center Hall 2