Endura Trillium ALD

With the advent of 3D transistor architectures such as FinFET and gate-all-around, chipmakers require new ways to manufacture ultra-thin films with excellent conformality and atomic-level thickness control. Even variation by a single layer of atoms can degrade device performance – driving the need for precise ALD solutions.

Built on Applied’s Endura^™ platform, Trillium^™ ALD deposits atomically thin films with uniform thickness and composition along high-aspect-ratio features, enabling chipmakers to create the most advanced and critical material layers with unprecedented precision. On the Endura, Trillium can be integrated with a host of clean and treatment technologies that can further boost device performance and yield.

Trillium ALD is a highly versatile deposition tool supporting a broad spectrum of films and applications. It can deposit numerous materials from high-k metal gate work-function metals and dipole layers, to liner and capping films. This breadth of capability enables Trillium ALD to be a cornerstone deposition technology for FinFET and gate all around chips, with the ability to extend to future complementary FET architectures.