Producer® Black Diamond® PECVD
The Black Diamond II nano-porous low-k film is the industry standard for the 45/32nm copper/low-k interconnects, with a k-value of approximately 2.5. Its predecessor, Black Diamond (k~3.0), is the industry-standard for the 90/65nm nodes. Creating nano-porous
The Producer Black Diamond 3 system is designed to work with the Applied Producer Nanocure™ 3 UV curing system. The Nanocure 3 system employs a high-intensity UV source to stabilize and densify the Black Diamond 3 film to provide optimum mechanical and optical properties. This two-step deposition and cure process provides up to twice the mechanical strength of Applied’s successful second generation Black Diamond film – reducing device variability and boosting chip yield.
The Black Diamond 3 film is deposited using the production-proven, high-throughput Producer GT platform.