Producer^® BLOk^™ PECVD

The Applied Producer BLOk (barrier low-k) PECVD system produces the industry's leading ultra-low-k copper barrier and etch stop films for damascene interconnect applications. With the Producer's Twin Chamber^® architecture, each wafer undergoes a patented in-situ copper oxide removal process prior to BLOk deposition, ensuring excellent adhesion to copper or cobalt to reduce electromigration.

BLOk膜は、誘電膜スタックの静電容量を大幅に削減すると同時に、継続的なRCスケーリングにおける優れたエッチング選択性と電気性能を維持します。定評のある表面準備・イニシエーション層プロセスにより、BLOkをBlack Diamondと簡単に統合でき、45nm以降のアプリケーションにおいて、次世代への移行を円滑に行うことができます。

On the production-proven, high-throughput Producer platform up to six wafers can be processed simultaneously for superior productivity and significant reduction in cost of ownership with high system reliability. Platform extendibility enables customers to leverage the Producer toolset for multiple process nodes.