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March 23, 2026
SEMVision G9 accelerates defect review across logic, memory and other devices, delivering higher productivity through trusted image quality and integrated AI that scales detection and classification across the fleet – at a competitive cost of ownership.
Why it matters: Increasing device complexity and 3D scaling are driving denser defect maps, creating load on review capacity SEMVision™ G9 expands the review budget by enabling more sites and samples at speed, so engineers can cover all layers - from FEOL to BEOL, without compromising cycle time or cost of ownership. Integrated AI further cuts manual effort and shortens time to result, accelerating high‑confidence production decisions.
What’s new:
Key applications: As the defect‑review leader, SEMVision supports a broad range of applications. The G9 brings unique capabilities, including beam e‑tilt, high depth-of-field-bevel imaging, DUV for bare and blanket wafers, material analysis, and the Elluminator wide BSE detector.
Bottom line: More wafers, more insight, less manual effort – SEMVision G9 pairs trusted imaging with integrated AI to drive faster, higher‑confidence production decisions.