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Posted
December 20, 2024
For more than a decade, Applied Materials has hosted a technical program alongside the IEEE International Electron Devices Meeting (IEDM) – the premier conference on leading-edge semiconductor technology. For this year’s program, we brought together some of the industry’s brightest minds to discuss the future of chip packaging in the AI era. Moderated by prominent industry analyst and YouTube educator Dr. Ian Cutress, the panel featured experts from AMD, Intel, Cadence and Applied.
Driven by an insatiable appetite for data, AI is introducing a new set of demands to the semiconductor roadmap. As traditional 2D scaling has slowed, innovation in 3D architectures has accelerated across multiple vectors – from the device to the system level. Perhaps the biggest impact has been in advanced packaging, which creates entirely new opportunities for volumetric scaling through heterogeneous integration.
Key takeaways: Now that the first 3D packaged systems are on the market, what will it take for the industry to move “beyond 3D” and enable the true potential of AI? Several key themes emerged from the thought-provoking discussion as our panelists debated the question, "3D Is Here, Now What?":
More context: Here is a video replay of the entire discussion:
A picture is worth a thousand words: Below is a selection of photos from the panel.
Ian Cutress, Founder and Chief Analyst, More Than Moore
Deepak Kulkarni, Senior Fellow, Advanced Technology Integration, AMD
Johanna Swan, Fellow, Director of Package Research and Systems Solutions, Intel
Kam Kittrell, Vice President, Product Management, Digital Signoff Group, Cadence
Terry Lee, Vice President and General Manager, Heterogeneous Integration Business, Applied Materials