IoT, Communications, Automotive, Power and Sensors (ICAPS)

IoT, Communications, Automotive,
Power and Sensors (ICAPS)

As the products we use and the world around us get smarter, they demand more silicon content, most of which is not leading-edge logic and memory. These are the semiconductor chips in products and devices that comprise ICAPS—Internet of Things (IoT), Communications, Automotive, Power and Sensors.

ICAPS devices play a highly enabling role in the Artificial Intelligence (AI) era–they are the specialty chips that can sense the world, generate information and communicate over the airwaves. Applied Materials is enabling innovation across ICAPS devices and helping customers in these end markets accelerate and advance their technology roadmaps.

Our Master Class on ICAPS is a great way to start building an understanding of the technologies that enable these end markets.

ICAPS graphic
Cell Phone

The fourth era of computing is marked by IoT, Big Data and AI creating a new wave of growth for the semiconductor industry. By 2025, machines are expected to generate 99 percent of the data created each year. Most of this data will come from the billions of IoT products on the network edge. The edge includes multi-billion-dollar markets like automotive, mobile computing, communications, industrial and home IoT, wearables, and healthcare. ICAPS devices such as CMOS image sensors, optoelectronics devices, RF chips, power devices and analog-to-digital converters define how these IoT products function and interact with the physical world.

The end markets for ICAPS are unique and highly specialized, both from a market perspective and from a materials engineering perspective. With our broad portfolio of materials engineering technologies, including co-optimized and integrated solutions, Applied Materials is creating the breakthroughs that enable the next wave of edge devices.