아날로그 및 혼합 신호 IC의 성장은 무선 기술의 확대로 촉진되었습니다. 이러한 부류의 소자에서는 더 높은 주파수와 출력이 요구됩니다.
The ongoing development and evolution of 200mm production technologies deliver device and yield improvements and overall fab productivity gains - all of which translate to sustained ROI for semiconductor manufacturers.
To address these requirements device manufactures are continuing to reduce their technology node at 200mm, moving to ≤0.13µm devices. Applied Materials offers chamber and system upgrades that enable installed base tools to meet these tighter performance requirements as well as provide higher throughput for increased fab productivity. These upgrades include remote clean for CVD chambers and pumping improvements for metal etch to improve particle performance as well as local center finding capability to improved wafer placement for PVD applications.
