SmartFactory MES FACTORYworks+ is an out-of-the-box manufacturing execution system developed for semiconductor back-end and...
View product detail
You have been using PROMIS for many years—but are you taking advantage of recent releases? PROMIS continues to provide up‐to‐date...
The integrated post-CMP Mesa cleaner, also available for 150mm and 200mm, effectively removes slurry, preventing residue formation and...
Manufacturers are striving to maintain uninterrupted software system availability because unscheduled downtime can cripple production,...
The Nokota system expands the Applied Materials suite of electrochemical deposition systems with a high-productivity wafer-level...
Continued process scaling is driving new levels of device performance. ALD technology is essential for a growing number of steps in...
The need for readily available, high quality and cost-effective spare parts is a key concern for customers, whether they are running the...
Applied OnDemand™ services offer a way for customers to order field engineering support on Applied Materials equipment. These services...
SmartFactory Rx Operations Productivity reclaims capacity, maximizes throughput and real-time adaptive scheduling.
Applied Performance Service (APS) is the most comprehensive service solution available for Applied Materials equipment. The APS product...
SmartFactory Rx Predictive Maintenance prevents costly downtime.
Applied preventive maintenance (PM) service agreements, available as an add-on with Applied Standard Service or during warranty, provide...
Running at virtually every advanced DRAM, NAND flash, and NOR flash manufacturing site, the system produces the industry's first...
TSV fabrication involves thinning device wafers and bonding them to temporary carriers made of glass or silicon. As typical bonding...
The Black Diamond II nano-porous low-k film is the industry standard for the 45/32nm copper/low-k interconnects, with a k-value of...
BLOk films enable significant reductions in the capacitance of the dielectric film stack, while maintaining excellent etch selectivity...
The system offers an integrated stress nitride deposition and UV cure that delivers tensile stress of up to 1.7GPa, while meeting low...
With thousands of systems shipped worldwide, the Applied Producer platform is the most cost-effective wafer processing product in the...
Used in conjunction with Applied Materials' APF™ (Advanced Patterning Film) strippable CVD hardmask, the APF/DARC film stack...
While offering the highest throughput density with the Twin Chambers and a two-FOUP, dual robot factory interface, Producer Etch...
Chip manufacturers are continuously designing chips with smaller and smaller transistors to gain more functionality per square...
Using patented ozone/TEOS chemistry, the unique HARP process enables enhanced transistor performance by depositing strain-inducing films...
For customers diversifying to TSV processing, the InVia system offers not only a benchmark process but demonstrated integration...
Black Diamond II nano-porous low-k film is the industry standard for the 45/32nm copper/low-k interconnects, with a k-value of...
