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    SmartWeb

    APPLIED SMARTWEB™

    Complete scalability from R&D to production Web widths from 400mm (SmartWeb SL) to 1400mm (SmartWeb XL) 3 (SmartWeb SL) to 12 (...

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    SmartWeb

    APPLIED SMARTWEB™ WF

    IR reflection coatings with high transmittance in the visible spectrum on flexible substrates Improves product quality with thickness...

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    Applied Tempo™ Metallization System

    The Tempo screen printer sets a new standard in cell manufacturing, supporting fast ramp time to production, a proven industry-record...

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    TopBeam 1100

    APPLIED TOPBEAM™ 1100

    Based on more than 35 years of experience with electron beam web coating and sputtering web coating, the TopBeam™ 1100S system combines...

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    TopBeam 2850

    APPLIED TOPBEAM™ 2450/2850

    A wide variety of different metals and oxides can be evaporated with Applied’s high-power electron beam evaporation. This process offers...

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    APPLIED TOPCOIL™

    The TopCoil™ platform complements Applied Materials’ evaporation portfolio with induction heated crucible technology. This is a solution...

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    TopMet

    Applied TopMet™

    With a coating speed of up to 20 meters per second, unparalleled productivity and winner of numerous design awards, the TopMet...

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    TopMet Clear

    APPLIED TOPMET™ CLEAR

    Two advanced AlOx processes and option for organic top-coating

    The AlOx-ECON process minimizes capital cost while producing 15-20...

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    TopMet IP

    APPLIED TOPMET™ IP

    Our vacuum metallizer features inline printing of both grey-scale and patterned structures on polymeric substrates and paper,...

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    Applied Vericell™ Solar Wafer Inspection System

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    Applied® Sigmameltec® CTS Mask Coat Series

    Achieving world class photomask CD uniformity begins with the quality of resist coating. At the nanometer scale many subtle factors...

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    Applied® Sigmameltec® MRC Mask Clean Series

    Cleaning methods for photomasks used in 193i and EUV lithography are driven by sensitive mask materials and the environments in which...

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    Applied® Sigmameltec® SFB Mask Bake Series

    The use of chemically amplified resists for photomask manufacturing requires tight control of the post exposure bake (PEB) step, which...

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    Applied® Sigmameltec® SFD Mask Develop Series

    Accurate development of the exposed resist pattern is essential to preserving the inherent CD uniformity of a photomask that has gone...

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    Centris® Sym3® Etch

    As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...

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    Ensuring that this enhanced within-chip etch precision extends across the entire wafer, the Centris Sym3 system has been comprehensively...

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    Centris® Sym3® Y Etch

    Semiconductor scaling continues steadily into the single-digit nodes, setting increasingly demanding requirements for precision and...

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    Centura® DPN HD

    The Centura DPN HD (high dose) system consists of decoupled plasma nitridation (DPN) and post-nitridation anneal (PNA) chambers...

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    Centura® DXZ CVD

    Applications in the advanced CMOS and MtM segments are driving the need for advanced 150mm and 200mm CVD technology. Ultra-thick oxides...

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    Epi 200mm

    Centura® EPI 200mm

    Responding to evolving power and MEMS device requirements, device manufacturers are targeting thicker epitaxial layers. Film thicknesses...

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    Close up of Applied Materials Metal Etch DPS Plus

    Centura® Etch

    Applied Materials Centura Etch system delivers high-productivity silicon, metal, and dielectric etch. Etching is one of the most...

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    iSprint

    Centura® iSprint™ ALD/CVD SSW

    Tungsten, with its low resistivity and minimal electro-migration, has long been used in logic and memory devices as the material of...

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    View of Centura RP EPI system from above, used for CMOS technology in semiconductor production

    Centura® RP Epi

    CMOS technology requires two types of transistors: PMOS and NMOS. The former benefits best from applying compressive...

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    Centura Silvia Etch is designed for the deep silicon etch required to create the vertical connections between chips or wafers

    Centura® Silvia™ Etch

    TSV offers product designers a new and highly space-efficient degree of freedom by enabling integration of circuit components from...

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    Centura® Tetra™ EUV Advanced Reticle Etch

    Extreme ultraviolet (EUV) photomasks are used for transferring circuitry patterns onto wafers with new lithography systems using high-...

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