The Applied PECVD 5.7 system deposits the active layers of thin film silicon solar panels on glass substrates up to 5.7m2 in area...
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The Tempo screen printer sets a new standard in cell manufacturing, supporting fast ramp time to production, a proven industry-record...
Based on more than 35 years of experience with electron beam web coating and sputtering web coating, the TopBeam™ 1100S system combines...
A wide variety of different metals and oxides can be evaporated with Applied’s high-power electron beam evaporation. This process offers...
The TopCoil™ platform complements Applied Materials’ evaporation portfolio with induction heated crucible technology. This is a solution...
With a coating speed of up to 20 meters per second, unparalleled productivity and winner of numerous design awards, the TopMet...
Two advanced AlOx processes and option for organic top-coating
Our vacuum metallizer features inline printing of both grey-scale and patterned structures on polymeric substrates and paper,...
Achieving world class photomask CD uniformity begins with the quality of resist coating. At the nanometer scale many subtle factors...
Cleaning methods for photomasks used in 193i and EUV lithography are driven by sensitive mask materials and the environments in which...
The use of chemically amplified resists for photomask manufacturing requires tight control of the post exposure bake (PEB) step, which...
Accurate development of the exposed resist pattern is essential to preserving the inherent CD uniformity of a photomask that has gone...
The groundbreaking Applied Centris platform clusters up to eight process chambers – six etch and two plasma clean chambers. A high-speed...
As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...
Advanced chamber materials reduce cost of ownership and increase throughput by making possible "clean-mode" operation. In addition,...
The Applied Avatar system combines step-to-step temperature tuning and control, which ensures the correct temperature set point...
In the DPN HD nitridation process, silicon oxide dielectric is infused with nitrogen using low-energy, pulsed plasma to create the...
Silicon carbide (SiC) is among the new materials emerging for high-speed applications. However, its transparency makes wafer handling...
The Applied Centura Epi system is a production-proven, single-wafer, multi-chamber epitaxial silicon deposition system with ~900 200mm...
The Centura single-wafer, multi-chamber architecture enables integrated, sequential wafer processing in up to four process chambers....
In a compact footprint, up to three Ultima HDP CVD chambers can be installed onto the production-proven Centura platform for a...
