Tza-Jing Gung, Ph.D.

AVP, Semiconductor Products Group

Tza-Jing Gung is appointed vice president and general manager of the Metal Deposition Products (MDP) business unit and an Applied Material Fellow.

Dr. Gung was previously general manager of the Chemical Vapor Deposition (CVD) division within the Dielectric Deposition Products business unit, responsible for CVD product technology, application development and market share growth. Before joining CVD, Dr. Gung led the Etch Strategic Products Group to achieve successful penetration for Mesa and Producer products at TSMC.

Dr. Gung first joined Applied Materials in 1999 to work on MDP, developing critical technologies for physical vapor deposition (PVD) that included high density DC plasma used to form conformal film, capillary-effect-assisted metal-filling technology, and self-collimated bottom up deposition with zero overhang and asymmetry. He has also led groups in PVD and CVD.

Dr. Gung received his Ph.D. in Electrical Engineering and Computer Science from the Massachusetts Institute of Technology. He holds more than 30 patents for PVD, CVD and Etch products.