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nanochip fab solutions

Nanochip Cover
2016 年冬

随着摩尔定律在实践和物理上的局限被逐渐突破,一些晶圆制造商正在规划新的蓝图以实现“后摩尔定律”(More Moore) 先进 CMOS 技术或“超越摩尔定律”(More than Moore) 非数字功能。无论您采用哪种规划,本期 Nanochip 聚焦专刊都将提供解决方案,以更好地满足您的需求。更多自动化工具。更多工艺改进。更高产能和成品率。更大利润。

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Previous Issues

Previous Issues

I sometimes divide information into “heads down,” which describes new design and manufacturing tools, for example, and “heads up,” which includes changes in the worldwide economy, consumer spending trends, and other “big picture” data.

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The ITRS semiconductor roadmap has morphed into the International Roadmap for Devices and Systems (IRDS), with a different, more system - and application-focused purpose than the scaling-oriented ITRS.

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Chemical mechanical planarization/polishing (CMP) processing is affected by various factors, including consumables, process parameters, and polisher hardware design.

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Fully automated fabs offer significantly better yields, output, cycle times, operating costs and flexibility than partially automated ones.

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When Dan Hutcheson, CEO of market research firm VLSIresearch, remarked that "200 is the new 450," he was not just poking fun at the nearly stillborn wafer size transition. "200[mm] is hot," he explained, noting that it is attracting more of the industry’s energies toward innovations ranging from new process chambers to advanced automation techniques.

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Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texas-based Novati Technologies, a relatively small company with outsized importance in the 3D development field.

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Applied has developed a new output improvement service solution for the 200mm Endura system to quickly modernize the equipment, improve process control and increase output by an average of 10%.

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There was a period, one that ended five or more years ago, when the semiconductor equipment industry put nearly all of its attention into improving 300mm manufacturing. Then smartphone sales exploded.

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为了提高制造流程的可持 续性,许多制造商采用工厂自 动化这一关键策略,因为该策 略可减少污染、库存、不必要 的加工环节和设备空载时间。 SanDisk 上海封装及测试工厂 的试点项目展示了这一方法的 良好前景。

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不同客户的:在当今高度竞争和快速变化 的市场中尽可能快地获取最大利润

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