skip to main content

nanochip fab solutions

Article Library

Equipment & Materials Engineering

Benchmarking & Productivity

Advanced Process Control & Data Analytics

自动化软件

Energy & Fab Sustainability

Parts & Services

Marketing & Industry Trends

Previous Issues

Previous Issues

离子注入设备对半导体制造厂商必不可少,因为制造栅极和阱等晶体管结构时必须向硅 中注入砷、硼和磷等掺杂剂。无论客户是生产最先进的 300 毫米数字逻辑和存储电路, 是利用 200 毫米工艺构建模拟、功率和其他产品,还是制造 CMOS 图像传感器,都需要 离子注入设备。

Read more

I sometimes divide information into “heads down,” which describes new design and manufacturing tools, for example, and “heads up,” which includes changes in the worldwide economy, consumer spending trends, and other “big picture” data.

Read more

The ITRS semiconductor roadmap has morphed into the International Roadmap for Devices and Systems (IRDS), with a different, more system - and application-focused purpose than the scaling-oriented ITRS.

Read more

Chemical mechanical planarization/polishing (CMP) processing is affected by various factors, including consumables, process parameters, and polisher hardware design.

Read more

Fully automated fabs offer significantly better yields, output, cycle times, operating costs and flexibility than partially automated ones.

Read more

When Dan Hutcheson, CEO of market research firm VLSIresearch, remarked that "200 is the new 450," he was not just poking fun at the nearly stillborn wafer size transition. "200[mm] is hot," he explained, noting that it is attracting more of the industry’s energies toward innovations ranging from new process chambers to advanced automation techniques.

Read more

Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texas-based Novati Technologies, a relatively small company with outsized importance in the 3D development field.

Read more

Applied has developed a new output improvement service solution for the 200mm Endura system to quickly modernize the equipment, improve process control and increase output by an average of 10%.

Read more

There was a period, one that ended five or more years ago, when the semiconductor equipment industry put nearly all of its attention into improving 300mm manufacturing. Then smartphone sales exploded.

Read more

为了提高制造流程的可持 续性,许多制造商采用工厂自 动化这一关键策略,因为该策 略可减少污染、库存、不必要 的加工环节和设备空载时间。 SanDisk 上海封装及测试工厂 的试点项目展示了这一方法的 良好前景。

Read more