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Our differentiated device performance and yield innovations enable today’s mobile technologies. Expanding the frontiers of precision materials engineering, and transistor and interconnect technologies, we lead the semiconductor industry in solving new challenges to make smaller, faster and more functional chips.

Drivers of Today's Mobile Technologies

Semiconductor chips are getting faster, smaller, and more multi-functional to meet demands of today’s mobile technologies. To make this possible, wafer patterning, and transistor and interconnect fabrication are being carried out at smaller and smaller dimensions, driving the transition from 2D to 3D chip designs.

The Shift to Materials-Enabled 3D

To enable next-generation high-performance chips, the industry is migrating from lithography-enabled 2D transistors and 2D memory devices to materials-enabled 3D architectures that are driving major advances in semiconductor technologies.
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