Low Temperature Co-Fired
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The LTCC package is made by assembling multiple single layers of a ceramic/glass/organic (green) sheets. The individual sheets are punched to form the vias, and then screen printed with conductive, dielectric and resistive pastes to form the circuit elements. The layers are collated and the stack fired at 850-900°C, resulting in a robust substrate with excellent dielectric properties, low thermal expansion coefficient, and excellent thermal conductivity.The multilayer electronic circuit is then completed by mounting the active and surface mount devices on top of the fired stack.
For more information on LTCC equipment, contact email@example.com.