MEMS 器件应用范围的扩大（包括加速度计、陀螺仪和麦克风等应用），成为当前移动、汽车和医疗设备市场转型的主要推动力。随着多功能或“组合”传感器封装的开发，MEMS 器件的应用进一步加速，其占用面积更小，使得在类似的设备尺寸上可以集成更多的功能。要实现这些组合器件需要使用新的材料和器件集成方案，其中包括沉积和刻蚀厚外延以降低功率，以及…
In addition to thick Epi and deep reactive ion etch (DRIE), MEMS manufacturers are implementing novel materials like ultra-thick oxides (>20µm), AlN, piezo-electric materials (e.g. PZT) and low temperature CMOS compatible films such as SiGe. They are also moving to new packaging processes like through silicon vias (TSV) which facilitate device stacking.
With much of the growth from consumer devices, time to market and cost are increasing challenges for MEMS makers and increases the need for high productivity, high yield production tools. To support this, Applied is developing new 200mm capability on our production proven platforms for these and other technology challenges in the MEMS market.
