Ginestra® Software address your mainstream and emerging technology needs

Mainstream Technologies

3D NAND

Material innovations and stack engineering enabling cell scaling and performance improvements

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DRAM → 3D DRAM

Material stack engineering for DRAM and 3D DRAM cell scaling and optimization
 

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FinFET → GAA

HKMG stack engineering and metrology supporting FinFET to 3D GAA/nanosheet transition
 

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Emerging Technologies

Phase Change Memory

Captures full physics of chalcogenide materials to enable Phase Change Memory (PCM) scaling
 

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Ovonic Threshold

Full physical/defect-centric model to enable Ovonic Threshold Switching (OTS) selector optimization for advanced memories

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Resistive RAM

Reproduce ion/vacancy diffusion, chemical reactions, statistics for AI applications

 

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Ferroelectric

Materials and atomic defect focus to unlock ferroelectric device (FeFET, FRAM) performance and reliability
 

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Solve your materials and stack engineering challenges