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                  Centris® Sym3® Y Etch

                  Semiconductor scaling continues steadily into the single-digit nodes, setting increasingly demanding requirements for precision and...

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                  Endura® Volta™ Selective W CVD

                  Tungsten has been widely used as a gapfill material in middle-of-line (MOL) contacts for its low resistivity and bulk fill...

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                  ALTA 4700DP

                  ALTA® 4700DP Mask Writer

                  The ALTA 4700DP system provides cost-effective patterning of binary masks and phase shifting masks (PSM), supporting fast turnaround and...

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                  Aera4™ Mask Inspection

                  The Applied Aera4 Mask Inspection system is a fourth-generation 193nm-based inspection tool unique in combining true aerial imaging with...

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                  Aeris™-G Plasma Abatement System

                  The Applied Aeris-G system is a pre-pump plasma abatement solution that uses less energy by treating the actual process gas volume—a...

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                  Aeris-S

                  Aeris™-S

                  Designed to treat the “dirtiest” applications, the Aeris-S operates by converting problematic materials into compounds that can be...

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                  Aeris-Si

                  Aeris™-Si

                  Aeris-Si is an integrated solution for subfab foreline cleaning to manage silica load and improve pump lifetime. The solution enables a...

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                  Applied MDLx™ Ginestra™ Simulation Software

                  Ginestra™ is a software product designed to simulate the operation and electrical characteristics of modern logic (e.g., FinFET, FeFET)...

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                  Applied® Sigmameltec® CTS Mask Coat Series

                  Achieving world class photomask CD uniformity begins with the quality of resist coating. At the nanometer scale many subtle factors...

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                  Applied® Sigmameltec® MRC Mask Clean Series

                  Cleaning methods for photomasks used in 193i and EUV lithography are driven by sensitive mask materials and the environments in which...

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                  Applied® Sigmameltec® SFB Mask Bake Series

                  The use of chemically amplified resists for photomask manufacturing requires tight control of the post exposure bake (PEB) step, which...

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                  Applied® Sigmameltec® SFD Mask Develop Series

                  Accurate development of the exposed resist pattern is essential to preserving the inherent CD uniformity of a photomask that has gone...

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                  Centris® Sym3® Etch

                  As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...

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                  Ensuring that this enhanced within-chip etch precision extends across the entire wafer, the Centris Sym3 system has been comprehensively...

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                  Centura® DPN HD

                  The Centura DPN HD (high dose) system consists of decoupled plasma nitridation (DPN) and post-nitridation anneal (PNA) chambers...

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                  Centura® DXZ CVD

                  Applications in the advanced CMOS and MtM segments are driving the need for advanced 150mm and 200mm CVD technology. Ultra-thick oxides...

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                  Epi 200mm

                  Centura® EPI 200mm

                  Responding to evolving power and MEMS device requirements, device manufacturers are targeting thicker epitaxial layers. Film thicknesses...

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                  Close up of Applied Materials Metal Etch DPS Plus

                  Centura® Etch

                  Applied Materials Centura Etch system delivers high-productivity silicon, metal, and dielectric etch. Etching is one of the most...

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                  View of Centura RP EPI system from above, used for CMOS technology in semiconductor production

                  Centura® RP Epi

                  CMOS technology requires two types of transistors: PMOS and NMOS. The former benefits best from applying compressive...

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                  Centura Silvia Etch is designed for the deep silicon etch required to create the vertical connections between chips or wafers

                  Centura® Silvia™ Etch

                  TSV offers product designers a new and highly space-efficient degree of freedom by enabling integration of circuit components from...

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                  Centura® Tetra™ EUV Advanced Reticle Etch

                  Extreme ultraviolet (EUV) photomasks are used for transferring circuitry patterns onto wafers with new lithography systems using high-...

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                  Centura® Tetra™ Z Photomask Etch

                  The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...

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                  Centura® Ultima HDP CVD®

                  The Applied Centura Ultima HDP CVD 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading...

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                  iSprint

                  Centura® iSprint™ ALD/CVD SSW

                  Tungsten, with its low resistivity and minimal electro-migration, has long been used in logic and memory devices as the material of...

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                  Charger® UBM PVD

                  The Applied Materials Charger UBM PVD system defines a new standard in metal deposition productivity and reliability for chip...

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