At various stages in making a microchip, the surface of the wafer has to be made perfectly flat, or planarized. This is done either to remove excess material, or to create a perfectly flat foundation for adding the next layer of circuit features.
Applied Mirra CMP provides production-proven, high performance 150mm and 200mm planarization solutions for silicon, shallow trench...
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As the industry’s leading 300mm CMP platform, the Reflexion LK CMP system has been thoroughly refreshed to incorporate the latest...
Featuring sequential processing stations using four polishing pads, six polishing heads, eight cleaning chambers, and two drying...