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    Centura Silvia Etch is designed for the deep silicon etch required to create the vertical connections between chips or wafers

    Centura® Silvia® Etch

    TSV offers product designers a new and highly space-efficient degree of freedom by enabling integration of circuit components from...

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    Centura® Tetra™ EUV Advanced Reticle Etch

    Extreme ultraviolet (EUV) photomasks are used for transferring circuitry patterns onto wafers with new lithography systems using high-...

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    Centura® Tetra™ Z Photomask Etch

    The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...

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    Centura® Ultima HDP CVD®

    The Applied Centura Ultima HDP CVD 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading...

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    CERTIFIED REFURBISHMENT

    Our Certified Refurbishment service is a perfect solution for customers looking for a simple way to repair broken parts and save the...

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    Charger® UBM PVD

    The Applied Materials Charger UBM PVD system defines a new standard in metal deposition productivity and reliability for chip packaging...

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    Endura Cobalt

    Cobalt Product Suite

    Applied Materials continues to extend its technical leadership in metallization, introducing the most significant material innovation in...

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    Dispatching & Reporting

    Dispatching & Reporting

    Applied SmartFactory Dispatching & Reporting is an automated decision system that improves factory productivity and reduces...

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    Durables Management

    Durables Management

    High complexity in manufacturing requires sophisticated durable management. Such complexity can be effectively managed only through...

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    Endura® ALPS® PVD (ALPS Co & Ni)

    The Applied Endura ALPS (Advanced Low-Pressure Source) Cobalt PVD (Physical Vapor Deposition) system offers a simple, high-performance...

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    Close up of Endura® Amber™ PVD, a proven all-in-one system combines cold deposition and high-temperature thermal copper reflow

    Endura® Amber™ PVD

    Reliable and complete filling of interconnect trench and via structures with copper is vital for device reliability in microelectronic...

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    Endura® Avenir® RF PVD

    As devices scale down, greater feature fragility and higher aspect ratios are making it more difficult for current PVD technology to...

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    Endura

    ENDURA® CIRRUS™ HT Co PVD

    As integrated circuits and their components continue to scale downward, the dimensions of metal interconnects and contacts between...

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    Endura® Cirrus™ HTX PVD

    Revolutionizing physical vapor deposition (PVD) technology for titanium nitride (TiN) thin films, the Endura Cirrus HTX TiN solves...

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    MRAM

    Endura® Clover® MRAM PVD

    The Applied Endura Clover MRAM PVD system is the first production-worthy, Integrated Materials Solution™ for high-volume manufacturing (...

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    Endura CuBS (Copper Barrier/Seed) RFX PVD system

    Endura® CuBS RF XT PVD

    The Applied Endura CuBS (Copper Barrier/Seed) RF XT PVD system serves logic and memory applications at the 3x/2x node and beyond. The...

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    Endura® iLB™ PVD/ALD

    The Applied Endura iLB PVD/ALD system with Centinel® chambers answers the challenge of growing contact resistance as dimensions shrink...

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    PCRAM System

    ENDURA® IMPULSE™ PCRAM PVD

    The Applied Endura® Impulse™ PVD system is a production-worthy, Integrated Materials Solution™ for high-volume manufacturing (HVM) of...

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    Endura® PVD

    The Applied Endura platform is the most successful metallization system in the history of the semiconductor industry. With its...

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    Endura® Underbump Metallization PVD

    Applied Materials brings extensive PVD experience to back-end packaging, including NiV, Cu, Ti, TiW, CuCr, TaN, and AI, with proven...

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    Endura® Ventura® PVD

    As two-dimensional (2D) device scaling reaches physical and electrical limits, TSV technology is a means of transitioning to compact,...

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    Endura

    Endura® Versa™ XLR2 W PVD

    As integrated circuits and their components continue to scale downward, the dimensions of metal interconnects and contacts between...

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    Endura® Volta® W CVD

    Tungsten has been widely used in logic contact, middle-of-line, and metal gate fill applications for its low resistivity and conformal...

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    Endura® Volta® Cobalt CVD

    The Applied Endura® Volta® CVD Cobalt system sustains Applied’s technical leadership in CVD, introducing the first material change...

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