The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...
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The Applied Centura Ultima HDP CVD 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading...
Our Certified Refurbishment service is a perfect solution for customers looking for a simple way to repair broken parts and save the...
The Applied Materials Charger UBM PVD system defines a new standard in metal deposition productivity and reliability for chip...
Applied Materials continues to extend its technical leadership in metallization, introducing the most significant material innovation in...
Applied SmartFactory Dispatching & Reporting is an automated decision system that improves factory productivity and reduces...
High complexity in manufacturing requires sophisticated durable management. Such complexity can be effectively managed only through...
The Applied Endura ALPS (Advanced Low-Pressure Source) Cobalt PVD (Physical Vapor Deposition) system offers a simple, high-performance...
Reliable and complete filling of interconnect trench and via structures with copper is vital for device reliability in microelectronic...
As devices scale down, greater feature fragility and higher aspect ratios are making it more difficult for current PVD technology to...
As integrated circuits and their components continue to scale downward, the dimensions of metal interconnects and contacts between...
Revolutionizing physical vapor deposition (PVD) technology for titanium nitride (TiN) thin films, the Endura Cirrus HTX TiN solves...
The Applied Endura Clover MRAM PVD system is the first production-worthy, integrated platform for high-volume manufacturing (HVM) of...
The Applied Endura CuBS (Copper Barrier/Seed) RF XT PVD system serves logic and memory applications at the 3x/2x node and beyond. The...
The Applied Endura iLB PVD/ALD system with Centinel™ chambers answers the challenge of growing contact resistance as dimensions shrink...
The Applied Endura® Impulse™ PVD system is a production-worthy, integrated solution for high-volume manufacturing (HVM) of phase-change...
The Applied Endura platform is the most successful metallization system in the history of the semiconductor industry. With its...
Applied Materials brings extensive PVD experience to back-end packaging, including NiV, Cu, Ti, TiW, CuCr, TaN, and AI, with proven...
As two-dimensional (2D) device scaling reaches physical and electrical limits, TSV technology is a means of transitioning to compact,...
The Applied Endura® Volta™ CVD Cobalt system sustains Applied’s technical leadership in CVD, introducing the first material change...
Tungsten has been widely used in logic contact, middle-of-line, and metal gate fill applications for its low resistivity and conformal...
Tungsten has been widely used as a gapfill material in middle-of-line (MOL) contacts for its low resistivity and bulk fill...
Plasma enhanced chemical vapor deposition – thin film encapsulation (PECVD-TFE) system the Enflexor™ Gen 6H PECVD deposits superior...
