With each node, the stack thickness must scale down to meet ever decreasing EOT targets to achieve desired device performance. Scaling...
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Tungsten, with its low resistivity and minimal electro-migration, has long been used in logic and memory devices as the material of...
The system combines innovative ALD tungsten nucleation layer technology with the high-throughput Sprint CVD tungsten bulk fill process...
CMOS technology requires two types of transistors: PMOS and NMOS. The former benefits best from applying compressive...
In the drive to maximize the functionality-to-volume ratio, device makers are integrating chips using schemes. TSV technology...
EUV photomasks differ fundamentally from conventional photomasks that selectively transmit 193nm wavelength light to project circuit...
The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...
Its reactor design and process technology enable deposition of both undoped and doped films for a wide range of applications, including...
Our Certified Refurbishment service is a perfect solution for customers looking for a simple way to repair broken parts and save the...
The Applied Materials Charger UBM PVD system defines a new standard in metal deposition productivity and reliability for chip...
Applied Materials continues to extend its technical leadership in metallization, introducing the most significant material innovation in...
The Applied SmartFactory Defect Management solution integrates defect, wafer mapping, e-test, tool WIP, and metrology data for overall...
Applied SmartFactory Dispatching & Reporting is an automated decision system that improves factory productivity and reduces...
High complexity in manufacturing requires sophisticated durable management. Such complexity can be effectively managed only through...
The Endura Al Slab PVD (Physical Vapor Deposition) system deposits aluminum over tungsten plugs in Logic and DRAM devices to form metal...
The Applied Endura ALPS (Advanced Low-Pressure Source) Cobalt PVD (Physical Vapor Deposition) system offers a simple, high-performance...
To date, ionized physical vapor deposition (PVD) has been able to achieve the required thickness and continuity of coverage on...
The Endura Avenir system's RF PVD technology addresses high-k/metal gate applications as well as logic contact silicidation to 22nm...
As integrated circuits and their components continue to scale downward, the dimensions of metal interconnects and contacts between...
Revolutionizing physical vapor deposition (PVD) technology for titanium nitride (TiN) thin films, the Endura Cirrus HTX TiN solves...
The Applied Endura Clover MRAM PVD system is the first production-worthy, integrated platform for high-volume manufacturing (HVM) of...
The thickness tuning capability of the EnCoRe II Ta(N) chamber enables customers to reduce barrier thickness for line...
Integrated on the industry-leading Endura platform, the system's deposition process addresses the need for scalable copper barriers...
The system integrates Siconi pre-silicide clean with PVD cobalt and TiN cap deposition for the direct contact application in the DRAM...
