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Mirra® MESA CMP 200mm

Applied Mirra CMP provides production-proven, high performance 150mm and 200mm planarization solutions for silicon, shallow trench isolation (STI), oxide, polysilicon, tungsten, and copper damascene applications. Its high-speed planarizing platens and multi-zone polishing heads enable superior uniformity and efficiency with low downforce.

The integrated post-CMP Mesa cleaner, available for both 150mm and 200mm, effectively removes slurry, preventing residue formation and minimizing particles and water marks. For copper damascene applications, the 200mm Desica® cleaning and rinsing technology with Marangoni® vapor drying for fast, effective, watermark-free drying is also an option.

The Applied Mirra CMP system also has options of multiple endpoint methods, in-line metrology, and advanced process control capabilities that deliver excellent within-wafer and wafer-to-wafer process control and repeatability for all planarization applications.

Optional advanced polishing technologies like Applied Materials’ Titan Profiler (150mm) and Titan Contour™ (200mm) head products and multi-platen configurations provide the ability to meet key uniformity metrics by tuning removal rates across the wafer surface to within 3mm of the wafer edge. These advanced capabilities and other released upgrades provide additional processing capabilities that achieve higher throughput and yield.