nanochip fab solutions

Photonic devices such as lasers, photodetectors, microLEDs, and photonic-integrated-circuits (PICs) are the building blocks for new technologies, including facial recognition, 3D sensing, and laser imaging, detection and ranging (LiDAR).

Applied Materials’ efforts to build a robust and sustainable supply chain for semiconductor and display manufacturing received increased focus earlier this year when the company announced its Supply Chain Certification for Environmental and Social Sustainability initiative (SuCCESS2030).

The Covid-19 pandemic has accelerated collaborative-while-remote development in the semiconductor industry because travel restrictions and improved cloud security have encouraged more semiconductor fabs to allow controlled visibility into fab data, according to participants at the Advanced Process Control and Smart Manufacturing (APCSM) 2020 Conference, held virtually in early October.

After years of hope and promise, the adoption of large-area OLED displays for televisions, laptops and computer monitors is finally beginning to happen.

Applied Materials’ new Applied SmartFactory® Fault Detection solution offers an economic, easy-to-implement way to improve tool and process performance in the back end.

As technology evolves, so does the demand for more power. Wide bandgap (WBG) materials such as gallium nitride (GaN) are demonstrating their potential as the backbone of next-generation power semiconductors.

Applied Materials is developing a quality improvement strategy that combines quality data in a cohesive and automated manner and maps the results into a Failure Mode and Effects Analysis (FMEA) system that provides users with recommended actions.

APC Conference goes virtual and expands its scope to encompass evolving smart manufacturing and Industry 4.0 topics; premier technical forum now called the Advanced Process Control Smart Manufacturing (APCSM) Conference.

Since its founding in 1967, Applied Materials has been developing technologies that enable customers to build the world’s most-advanced semiconductor devices.

Given the complexity of Applied Materials equipment and spare parts there are plenty of physical and environmental packaging challenges. To address these, Applied has expanded its staff of packaging engineers, set up a lab, and worked with suppliers around the globe to align its packaging specifications with customer needs.