Semiconductor scaling continues steadily into the single-digit nodes, setting increasingly demanding requirements for precision and...
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Tungsten has been widely used as a gapfill material in middle-of-line (MOL) contacts for its low resistivity and bulk fill...
The Nokota system expands the Applied Materials suite of electrochemical deposition systems with a high-productivity wafer-level...
Defect review, classification, and analysis are vital in semiconductor fabrication as the means to monitor and control the quality of...
The Applied Aera4 Mask Inspection system is a fourth-generation 193nm-based inspection tool unique in combining true aerial imaging with...
The Applied Aeris™-G system is a pre-pump plasma abatement solution that uses less energy by treating the actual process gas volume—a...
Ginestra™ is a software product designed to simulate the operation and electrical characteristics of modern logic (e.g., FinFET, FeFET)...
Achieving world class photomask CD uniformity begins with the quality of resist coating. At the nanometer scale many subtle factors...
Cleaning methods for photomasks used in 193i and EUV lithography are driven by sensitive mask materials and the environments in which...
The use of chemically amplified resists for photomask manufacturing requires tight control of the post exposure bake (PEB) step, which...
Accurate development of the exposed resist pattern is essential to preserving the inherent CD uniformity of a photomask that has gone...
As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...
These films join the broad portfolio of processes available on the Centura DxZ CVD system. The foundation of Applied’s strength in...
In the DPN HD nitridation process, silicon oxide dielectric is infused with nitrogen using low-energy, pulsed plasma to create the...
The Applied Centura Epi system is a production-proven, single-wafer, multi-chamber epitaxial silicon deposition system with ~900 200mm...
New 200mm technology challenges that Applied Centura Etch Reactors address include: silicon etching of aspect ratios >100:1 for MEMS...
CMOS technology requires two types of transistors: PMOS and NMOS. The former benefits best from applying compressive strain to the...
In the drive to maximize the functionality-to-volume ratio, device makers are integrating chips using schemes. TSV technology...
EUV photomasks differ fundamentally from conventional photomasks that selectively transmit 193nm wavelength light to project circuit...
The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...
Its reactor design and process technology enable deposition of both undoped and doped films for a wide range of applications, including...
Tungsten, with its low resistivity and minimal electro-migration, has long been used in logic and memory devices as the material of...
The Applied Materials Charger UBM PVD system defines a new standard in metal deposition productivity and reliability for chip...
