Chip manufacturers are continuously designing chips with smaller and smaller transistors to gain more functionality per square...
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Using patented ozone/TEOS chemistry, the unique HARP process enables enhanced transistor performance by depositing strain-inducing films...
For customers diversifying to TSV processing, the InVia system offers not only a benchmark process but demonstrated integration...
Black Diamond II nano-porous low-k film is the industry standard for the 45/32nm copper/low-k interconnects, with a k-value of...
In integrated circuits, current-carrying copper wiring is insulated by dielectric (non-conducting) materials. As semiconductor devices...
As CDs continue shrinking, the number of steps needed to pattern small structures is increasing, thus creating the need for treatments...
The Producer® Selectra™ Etch system introduces unprecedented capabilities for sustaining the momentum of Moore’s Law through further...
The Precision chamber’s specialized design enables uniform layer-to-layer deposition with the film quality required for the gate...
The RAIDER ECD system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition delivers high throughput...
The integrated post-CMP Desica® cleaner uses unique full-immersion Marangoni® vapor drying technology to virtually...
Featuring six polishing stations and eight integrated cleaning stations with advanced process controls, the system delivers the...
Below the 65nm technology node, the limitations of conventional batch high-energy implanters create device performance issues for high-...
The new system leverages the proven world-class particle performance of the VIISta platform beam line architecture. A filter magnet...
Repeatable and accurate implant angle control is critical for precision doping in high-volume manufacturing of advanced...
Innovations on the dual-magnet ribbon beam architecture improve beam line transmission, on-wafer beam utilization, and beam current...
The system delivers industry-leading dose retention and uniformity, with key features enabling the following benefits:
The new VIISta Trident system is the semiconductor industry’s most advanced single-wafer high-current ion implantation solution....
Designed with productivity, compactness, and reliability in mind, the Astra DSA system provides a compelling cost of ownership advantage...
The system's innovative technology breaks through the scaling barriers for critical oxidation steps like memory gate oxide, shallow...
The system leverages established Radiance chamber technology: honeycomb lamp source, seven-point temperature measurement, 100 Hz closed-...
In addition to superior temperature uniformity, the system offers a large process range from ultra-low to ultra-high...
The newest in the Applied Materials VeritySEM product family, VeritySEM 5i CD-SEM system features first-of-its-kind, in-line, 3D...
While monitoring tool operation, the Applied iSystem controller collects valuable data that can be used to generate resource consumption...
