Rapid thermal processing is used repeatedly during semiconductor device manufacturing for such purposes as activating implanted dopants or changing the state (or phase) of materials to enhance desired attributes (e.g., conductivity). Soak, spike, or millisecond anneals and dry rapid oxidation are applied to different applications.
Soak, spike, or millisecond anneals and dry rapid oxidation are applied to different applications. The choice of technology depends on several factors, including the tolerance of the device to withstand a certain temperature/time exposure at a particular point in the manufacturing sequence. Applied’s portfolio of laser and lamp-based systems encompass the full range of RTP technologies, offering extendible solutions to such advanced-node challenges as pattern loading, thermal budge reduction, current leakage, and interface quality optimization.
