nanochip fab solutions
In ancient times, people used to say that all roads lead to Rome, then the commercial center of one of the world’s greatest empires. With the globalization of today’s technology-based economy, we might well say that all roads lead to market.
BY Madhav Kidambi
In semiconductor front-end fabs as well as back-end assembly, test and packaging (ATP) facilities, efficient and flexible factory-floor production dispatching is vital to high productivity. Dispatching is the process of determining the next job that should be processed—ideally in real time—then assigning it to the right tool or station and ensuring it gets there at the right time and with minimum queue time.
By Nanochip Staff
Introduced in 1985, the ≤200mm silicon wafer generation has enjoyed longevity that is nothing short of amazing. More than Moore (MtM) devices such as MEMs sensors have expanded in variety and number, driven largely by smartphones.
BY David Lammers
When the conversation turns to cooperative semiconductor R&D centers, Applied Materials’ Maydan Technology Center (MTC) in Silicon Valley may not immediately come to mind. But MTC is becoming a busy hub where semiconductor customers work cooperatively with Applied on an ever-widening variety of technical challenges, from logic and memory to emerging memories for AI, IoT and other areas.
By Kerry Cunningham
Fundamental changes are occurring in the display industry, driven by demands for higher-resolution screens and other capabilities for both mobile and TV applications.
By David Lammers
Discussions about advanced process control (APC) often put the algorithms in the forefront and the engineer in the background. With deep learning receiving so much recent attention, people are understandably fascinated by its claimed potential to extract the value inherent in the data amassed by sensors, metrology tools and other sources.