PVD deposition processes are used in creating ultra-thin cap layers and metal gate films in high-k/metal gates for advanced transistors, and in forming ultra-thin barrier materials and seed layers for interconnects.
The Applied Endura® Impulse™ PVD system is a production-worthy, integrated solution for high-volume manufacturing (HVM) of phase-change...
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The Applied Endura Clover MRAM PVD system is the first production-worthy, integrated platform for high-volume manufacturing (HVM) of...
As integrated circuits and their components continue to scale downward, the dimensions of metal interconnects and contacts between...
The Applied Materials Charger UBM PVD system defines a new standard in metal deposition productivity and reliability for chip...
Applied Materials continues to extend its technical leadership in metallization, introducing the most significant material innovation in...
The Applied Endura ALPS (Advanced Low-Pressure Source) Cobalt PVD (Physical Vapor Deposition) system offers a simple, high-performance...
The Endura Al Slab PVD (Physical Vapor Deposition) system deposits aluminum over tungsten plugs in Logic and DRAM devices to form metal...
To date, ionized physical vapor deposition (PVD) has been able to achieve the required thickness and continuity of coverage on...
The Endura Avenir system's RF PVD technology addresses high-k/metal gate applications as well as logic contact silicidation to 22nm...
Revolutionizing physical vapor deposition (PVD) technology for titanium nitride (TiN) thin films, the Endura Cirrus HTX TiN solves...
The thickness tuning capability of the EnCoRe II Ta(N) chamber enables customers to reduce barrier thickness for line...
Integrated on the industry-leading Endura platform, the system's deposition process addresses the need for scalable copper barriers...
The system integrates Siconi pre-silicide clean with PVD cobalt and TiN cap deposition for the direct contact application in the DRAM...
Emerging applications in micro-electro-mechanical systems (MEMS), CMOS image sensors and packaging technologies such as through-silicon...
Active wafer temperature control and stress modulation facilitate integration between interconnect metals and solder bumps with low cost...
Designed specifically for TSV metallization, the Applied Endura Ventura PVD system is Applied’s latest innovation in physical...
The system offers a cost-effective way of using ALD (atomic layer deposition) technology to extend customers' existing iLB PVD/CVD...
