At various points in making a microchip, the surface of the wafer has to be made perfectly flat, or planarized. This is done either to remove excess material, or to create a perfectly flat foundation for adding the next layer of circuit features.
The integrated post-CMP Mesa cleaner, also available for 150mm and 200mm, effectively removes slurry, preventing residue formation and...
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The integrated post-CMP Desica® cleaner uses unique full-immersion Marangoni® vapor drying technology to virtually...
Featuring six polishing stations and eight integrated cleaning stations with advanced process controls, the system delivers the...
