Producer® Celera™ PECVD
The Applied Producer Celera PECVD system deposits tunable compressive and tensile high-stress silicon nitride films for strain engineering applications at 45nm and below.
The system offers an integrated stress nitride deposition and UV cure that delivers tensile stress of up to 1.7GPa, while meeting low thermal budget requirements. The same chamber can deposit films with compressive stresses up to 3.5 GPa. The process utilizes production-proven silane CVD technology to deliver superior step coverage (~70%) while retaining excellent SiN etch-stop properties and pattern-loading results.
The Applied Celera deposition and UV cure processes are integrated on the production-proven, high-throughput Producer platform with its flexible Twin Chamber® configuration and platform extendibility that enables customers to leverage the Producer toolset for multiple process nodes.