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DRAM and NAND Flash memory have long been reliable technologies, each used for specific purposes — DRAM for main memory to process large amounts of data and NAND as a nonvolatile memory ideal for data storage. Manufacturers continue to improve the performance of DRAM and NAND technologies yet although their roadmaps promise generations of future devices, additional types of memory are emerging for big data, artificial intelligence (AI), and cloud and edge computing applications. These new memory technologies include Phase-Change RAM (PCRAM), Magnetic RAM (MRAM), and Resistive RAM (ReRAM).

Higher performance, more power-efficient computing for AI, cloud, and edge applications requires significant advances in mainstream memory technologies and raises demand for new solutions. Innovations are needed to deliver faster data access, lower power consumption, and expanded data retention for larger workloads.

Scaling memory technologies to improve performance, power, area, and cost is enabled by advances in materials, manufacturing processes, and systems. As an example, scaling 3D NAND vertically depends largely on materials engineering using deposition and etch processes.

Emerging memory technologies will also take advantage of new materials and architectures that will be formed using novel deposition and etch/removal technologies. Applied has developed the systems to solve design and materials challenges, providing manufacturers with the capability to produce a range of high-performance, advanced memory chips.