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                  ALTA 4700DP

                  ALTA® 4700DP Mask Writer

                  The ALTA 4700DP system provides cost-effective patterning of binary masks and phase shifting masks (PSM), supporting fast turnaround and...

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                  Axcela PVD

                  AXCELA™ PVD

                  The best-in-class Applied Axcela PVD system has demonstrated process superiority and stability with non-uniformities of <2% 1σ over...

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                  Aera4™ Mask Inspection

                  The Applied Aera4 Mask Inspection system is a fourth-generation 193nm-based inspection tool unique in combining true aerial imaging with...

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                  Aeris™-G Plasma Abatement System

                  The Applied Aeris-G system is a pre-pump plasma abatement solution that uses less energy by treating the actual process gas volume—a...

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                  Aeris-S

                  Aeris™-S

                  Designed to treat the “dirtiest” applications, the Aeris-S operates by converting problematic materials into compounds that can be...

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                  Aeris-Si

                  Aeris™-Si

                  Aeris-Si is an integrated solution for subfab foreline cleaning to manage silica load and improve pump lifetime. The solution enables a...

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                  Applied MDLx™ Ginestra™ Simulation Software

                  Ginestra™ is a software product designed to simulate the operation and electrical characteristics of modern logic (e.g., FinFET, FeFET)...

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                  Applied Producer<sup>®</sup> XP Precision® Draco™ CVD

                  Applied Producer® XP Precision® Draco™ CVD

                  Today’s global digital transformation is driving the need for lower-cost, higher-density DRAM chips, particularly for data center...

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                  Applied® Sigmameltec® CTS Mask Coat Series

                  Achieving world class photomask CD uniformity begins with the quality of resist coating. At the nanometer scale many subtle factors...

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                  Applied® Sigmameltec® MRC Mask Clean Series

                  Cleaning methods for photomasks used in 193i and EUV lithography are driven by sensitive mask materials and the environments in which...

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                  Applied® Sigmameltec® SFB Mask Bake Series

                  The use of chemically amplified resists for photomask manufacturing requires tight control of the post exposure bake (PEB) step, which...

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                  Applied® Sigmameltec® SFD Mask Develop Series

                  Accurate development of the exposed resist pattern is essential to preserving the inherent CD uniformity of a photomask that has gone...

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                  CENTRIS® SYM3® Y ETCH

                  Semiconductor scaling continues steadily into the single-digit nodes, setting increasingly demanding requirements for precision and...

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                  Centris® Sym3® Etch

                  As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...

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                  Centura Prime RP Epi

                  Centura Prime® Epi

                  Leveraging Applied’s epitaxy expertise gained with the industry-leading Centura RP Epi system over almost two decades, the Centura Prime...

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                  Centura® DPN HD Gate Stack

                  In the DPN HD nitridation process, silicon oxide dielectric is infused with nitrogen using low-energy, pulsed plasma to create the...

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                  Centura® DXZ CVD

                  Silicon carbide (SiC) is among the new materials emerging for high-speed applications. However, its transparency makes wafer handling...

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                  Epi 200mm

                  Centura® EPI 200mm

                  The Applied Centura Epi system is a production-proven, single-wafer, multi-chamber epitaxial silicon deposition system with ~900 200mm...

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                  Close up of Applied Materials Metal Etch DPS Plus

                  Centura® Etch

                  The Centura single-wafer, multi-chamber architecture enables integrated, sequential wafer processing in up to four process chambers....

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                  Centura Silvia Etch is designed for the deep silicon etch required to create the vertical connections between chips or wafers

                  Centura® Silvia™ Etch

                  In the drive to maximize the functionality-to-volume ratio, device makers are integrating chips using schemes. TSV technology...

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                  Centura® Tetra™ EUV Advanced Reticle Etch

                  EUV photomasks differ fundamentally from conventional photomasks that selectively transmit 193nm wavelength light to project circuit...

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                  Centura® Tetra™ Z Photomask Etch

                  The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...

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                  Centura® Ultima HDP-CVD®

                  Its reactor design and process technology enable deposition of both undoped and doped films for a wide range of applications, including...

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                  iSprint

                  Centura® iSprint™ ALD/CVD SSW

                  Tungsten, with its low resistivity and minimal electro-migration, has long been used in logic and memory devices as the material of...

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