Semiconductor scaling continues steadily into the single-digit nodes, setting increasingly demanding requirements for precision and...
View product detail
Tungsten has been widely used as a gapfill material in middle-of-line (MOL) contacts for its low resistivity and bulk fill...
The ALTA 4700DP system provides cost-effective patterning of binary masks and phase shifting masks (PSM), supporting fast turnaround and...
The Applied Aera4 Mask Inspection system is a fourth-generation 193nm-based inspection tool unique in combining true aerial imaging with...
The Applied Aeris-G system is a pre-pump plasma abatement solution that uses less energy by treating the actual process gas volume—a...
Designed to treat the “dirtiest” applications, the Aeris-S operates by converting problematic materials into compounds that can be...
Aeris-Si is an integrated solution for subfab foreline cleaning to manage silica load and improve pump lifetime. The solution enables a...
Ginestra™ is a software product designed to simulate the operation and electrical characteristics of modern logic (e.g., FinFET, FeFET)...
Achieving world class photomask CD uniformity begins with the quality of resist coating. At the nanometer scale many subtle factors...
Cleaning methods for photomasks used in 193i and EUV lithography are driven by sensitive mask materials and the environments in which...
The use of chemically amplified resists for photomask manufacturing requires tight control of the post exposure bake (PEB) step, which...
Accurate development of the exposed resist pattern is essential to preserving the inherent CD uniformity of a photomask that has gone...
As semiconductor scaling has continued, increasingly rigorous requirements for precision and uniformity in chip fabrication have...
In the DPN HD nitridation process, silicon oxide dielectric is infused with nitrogen using low-energy, pulsed plasma to create the...
Silicon carbide (SiC) is among the new materials emerging for high-speed applications. However, its transparency makes wafer handling...
The Applied Centura Epi system is a production-proven, single-wafer, multi-chamber epitaxial silicon deposition system with ~900 200mm...
The Centura single-wafer, multi-chamber architecture enables integrated, sequential wafer processing in up to four process chambers....
CMOS technology requires two types of transistors: PMOS and NMOS. The former benefits best from applying compressive...
In the drive to maximize the functionality-to-volume ratio, device makers are integrating chips using schemes. TSV technology...
EUV photomasks differ fundamentally from conventional photomasks that selectively transmit 193nm wavelength light to project circuit...
The Applied Centura Tetra Z Photomask Etch system delivers state-of-the-art performance required to etch optical lithography photomasks...
Its reactor design and process technology enable deposition of both undoped and doped films for a wide range of applications, including...
Tungsten, with its low resistivity and minimal electro-migration, has long been used in logic and memory devices as the material of...
The Applied Materials Charger UBM PVD system defines a new standard in metal deposition productivity and reliability for chip...
