元件製造是一項複雜且關係重大的產業 — 且經過多年的發展,這項產業的難度絲毫沒有降低。面對這種形勢,我們打造了 FabVantage 顧問服務,為業務受到重大影響的客戶提供解決生產問題的方案。 憑藉應用材料公司深厚的技術基礎與經驗豐富的晶圓廠專家團隊,我們與全球客戶合作...
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Fault detection and classification (FDC) transforms sensor data into summary statistics and models that can be analyzed against user...
SmartFactory FullAuto is an automated execution system that improves factory productivity and eliminates white space by executing...
Today's manufacturers need a rule integration framework to facilitate quicker and better operational decisions. Accurately modeling...
在監視機台運行的同時,應用材料公司的 iSystem 控制器可收集用於生成資源消耗報告、溫室氣體排放報告以及其他環境因素報告的有價值數據。iSystem 控制器佔用空間小,每個控制器均能夠支持多達四台機台,並可輕鬆安裝到應用材料公司和非應用材料公司的 200mm 和...
SmartFactory Rx Knowledge Advisor converts operator know-how and experience into process understanding and stability.
In a factory environment, it is imperative for maintenance managers to have real‐time equipment data and flexible scheduling...
Growing complexity in Assembly and Test manufacturing has led to new challenges for Master Planning, including increased complication in...
Having an inadequate MCS solution impacts throughput and cycle time. Any interruption in the automation system caused by MCS reliability...
Can you execute globally coordinated efficient manufacturing operations, produce high quality products at reduced costs and enhance...
In today’s complex manufacturing environment, you need a way to apply your experience and expertise when running factory systems—systems...
When semiconductor manufactures produce wafers in a factory, they often come up against a lack of process capability or unexpected...
You have been using PROMIS for many years—but are you taking advantage of recent releases? PROMIS continues to provide up‐to‐date...
積體後 CMP Mesa 清洗器(同樣適用於 150mm 和 200mm 應用)能有效去除研磨液、防止殘渣形成,最大限度減少微粒和水痕。對於銅鑲嵌應用,也可以選擇 200mm Desica 清潔和沖洗技術,利用 Marangoni 蒸氣乾燥器,可實現快速、有效的無水印乾燥...
製程持續微縮推動元件效能邁向全新水準。ALD 對製造三維 NAND 和邏輯 FinFET 中越來越多的元件關鍵製程步驟至關重要。雖然使用 ALD 製程達到均勻一致的薄膜厚度,對臨界線寬控制仍然很重要,但 ALD 必須達到更多需求,...
Applied OnDemand™ services offer a way for customers to order field engineering support on Applied Materials equipment. These services...
無論是運用最新技術在全新設備上抑或是較舊的製程,客戶主要關注的都是否能即時獲得高品質且符合成本效益的備件。Applied OnDemand™ 隨選零件方案為客戶提供了訂購應用材料零件的簡便之道。On demand 隨選零件是滿足備件需求的最簡單解決方案,客戶按需採購零件,...
SmartFactory Rx Operations Productivity reclaims capacity, maximizes throughput and real-time adaptive scheduling.
SmartFactory Rx Predictive Maintenance prevents costly downtime.
幾乎每家先進的 DRAM、NAND 快閃記憶體和 NOR 快閃記憶體廠都會採用本系統,這是針對曝光圖樣淺溝隔離層、閘極、位元線、接觸點、電容器和導線等特殊功能生產的業界第一款商用 PECVD 可灰化非晶系碳膜系統。...
TSV 製造包括將元件晶圓薄化,並接合至玻璃或矽製成的臨時載體。典型接合黏著具有約 200ºC 的熱積存,因此這些混合晶圓接下來的所有製程都必須在低於 200ºC 的極低溫度下進行。低溫沉積高品質薄膜所需的 RF 功率會使晶圓表面大幅提高熱度。為了使晶圓溫度恆定不變,...
Black Diamond II 奈米多孔低介電值薄膜是 45/32 奈米銅/低介電值導電層的業界標準,其介電值約為 2.5。 低k 製造奈米多孔低介電值薄膜的製程為兩階段,包括以 PECVD 法沉積有機矽玻璃「支柱」及熱不穩定的有機相,然後以紫外缐 (UV)...
BLOk 薄膜能夠大幅降低介電薄膜堆疊層的電容值,同時還可維持良好的蝕刻選擇性和電性,並可持降低 RC 值。經過驗證的表面處理及起始層製程使 BLOk 薄膜可以很容易地與 Black Diamond 薄膜整合,以確保和 45 奈米和以上元件的順利轉換。
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本系統提供整合應力氮化沉積和紫外光固化,可提供高達 1.7GPa 的伸長應力,同時符合低熱積存要求。 使用同一反應室可沉積壓縮應力高達 3.5 GPa 的薄膜。 此製程運用經過生產驗證的矽烷 CVD (化學氣相沉積) 技術,可提供極佳的階梯覆蓋 (約 70%),...